This is the first in a series of discussions we would like to open up
regarding “favorite features” in an IC Packaging implementation design
We talk to customers all the time that are designing IC
packages with stacked die. While trough-silicon-via (TSV) is the wave
of the future, the vast majority today are wirebonding down to the
substrate from the upper die. Depending on which tools they are using,
some are unsure if the wires have proper clearance. Many throw it over
the wall to the process engineer on the manufacturing side and hope he
doesn’t throw it back. The truth is, this is old school mentality.
Today’s designers should be thinking 3D.
discussions with ecosystem partners, we hear similar stories from those
on the manufacturing side. A wirebond process engineer knows all the
detail of exactly how the wires will be shaped, but without a 3D view,
it can sometimes be difficult to put together the bonding strategy for a
complex stacked die device.
The answer, of course, is 3D
viewing technology that can be shared between design and manufacturing
engineers. At Cadence, we designed our 3D viewing technology to aid IC
Package designers with a tightly integrated 3D viewer. Designers can
view the package in its entirety, or they can slice out a section and
view that one piece. The viewer also provides 3D rule checks that
ensures that wires meet minimum clearance requirements. These kind of
checks simply are not possible when limited to two dimensions.
However, the 3D technology extends beyond the designer’s desktop.
Use of 3D viewing technology may be an important part of a design review
or something that needs to take place on the manufacturing floor.
However, these users of 3D viewing technology have little to no need to
edit the actual IC Package design. The convenience of being able to
drive the 3D viewing technology outside of the package design tool
leaving the designer’s licenses available for design work has been a big
help to many Cadence customers.
So, for this reason, we
choose flexible 3D viewing technology (stand alone or integrated with
design) as a favorite feature in an IC Package design solution.
Please let us hear about your experiences with Cadence 3D viewing
technology for IC Packaging solutions.
Sure "packaging" ... we have a team of application engineers world wide that can provide a demonstration on this technology. We will contact you off line to setup a demo at your site.