Hi guys perhaps you can help with this one. In Allegro the 3d view of a board is kind of neat but the components only show as rectangular blocks on the board. It appears the component's are extracting their information from the Package height properity but this properity alone cannot provide enough info to create a true 3D model of the component.
So my question is how would one go about creating a decent looking 3d model of say perhaps a soic8 so that the 3d viewer in allegro displays it as it would look in the real world. Put another way, when I create a Land pattern for say a SOIC8 what other properities would need to be set to define the 3D settings for the package.
Is this even possible in V16.5 ?
Yes, the 3D "modeling" capabilities of the tool are pretty basic but depending on how much time you want to spend creating symbols it is possible to get somewhat more realistic pictures.
The models are derived from the symbol's "place_bound_top" shapes as you know. The key is in realizing that you can have multiple shapes on that subclass with different "Package_Height_Max" and "Package_Height_Min" properties. Given the time and desire you could create shapes for the individual pins on an SOIC for example. You are only limited by the details you want to incorporate in the shapes.
In reply to Roger BFS:
Hi Roger, thanks for the reply. I had not thought about that subclass as you suggested so thats a big help right there. I will explore this and see what I can break : )
Thanks again Scott