I have a small board with high density components.
Altium designer have as default the components clearance (physical
distance between components) as 10mils. In the same range 10-15mils,
seems also in Orcad Cadence.
Many documents on Internet from pcb designers/manufacturers recommend in
case of wave soldering 50mils between components and worse case for
some situation 30mils.
What do you know about components clearance and wave soldering?
I use mostly SMD components.
I can hardly get 32 mils between components, but that would be the maximum
distance between them, otherwise will not fit on the board. And that is
possible when many of the components are 0603.
The PCB manufacturing process would be easier with 1206 sizes, but then I can have only 10-15mils max. clearance.
The next problem would their orientation, because I cannot respect for
all of them the recommended orientation preferred by the wave soldering.
Any thoughts here? What might happen if I use small 0603 sizes and I orientate them not as recommended?
I watched next video: http://www.youtube.com/watch?v=MhtbYinHnQs and I looked through the standards.
I need more a practical advice than what is recommended by standards.
Some links with components clearance that I have read:
Thanks for your opinions.