Corporate News

Cadence EDA Workflows Extend to Microsoft Azure Cobalt 200

2026-11-12T17:20:00Z

As chip designs become more complex, design and verification workloads are becoming increasingly compute-intensive. The rise of AI-driven and agentic workflows adds another dimension, with more automated and iterative tasks increasing the need for f...(read more)

Cadence Signs EuroCDP Agreement to Support European Chip Innovation

2026-11-12T08:00:00Z

Agreement with the European Chips Joint Undertaking extends access to Cadence EDA and Systems technologies and Managed Cloud Service for eligible European startups and SMEs. Cadence has signed an agreement with the European Chips Joint Undertaking (...(read more)

Big Millennium News Is Coming to SC'26: Visit Us at Booth 6310

2026-11-03T18:15:00Z

Accelerating engineering from semiconductors to AI factories AI is transforming engineering. From advanced semiconductors and high-speed interconnects to AI factories and digital twins, design complexity, simulation scale, and performance demands ha...(read more)

Cadence Expands Sovereign AI in Europe: From Chips to AI Factories

2026-11-03T14:00:00Z

European engineering teams are advancing increasingly complex chip and system design while building the infrastructure to run AI at scale. Both depend on substantial computing resources. Both involve sensitive intellectual property. And both require...(read more)

Cadence and Toyota Advance Automotive Simulation on NVIDIA AI Infrastructure

2026-10-21T11:30:00Z

Cadence is collaborating with Toyota Motor Europe (TME) to evaluate high-fidelity external aerodynamics and aeroacoustic simulation on the TME Aygo X model using NVIDIA Blackwell GPUs. The work demonstrates how accelerated computing can reduce turnar...(read more)

Cadence ASK Portal Enhances Support Experience with Built-In FTP Request Access

2026-10-21T03:30:00Z

Support experiences are most effective when they help users stay focused on solving the issue and moving through each step with clarity. That same goal is behind the continued evolution of the Cadence ASK Portal, which brings together smarter search,...(read more)

CadenceCONNECT: Simulation Conference Japan 2026

2026-10-14T15:00:00Z

Explore the Latest Simulation Technologies, Real-World Applications, and Digital Engineering Strategies for the Physical AI Era As products become more sophisticated and complex, engineering teams face growing pressure to accelerate development, imp...(read more)

Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

2026-10-09T16:00:00Z

Five awards. Five areas of collaboration. One shared focus: helping customers push the limits of what is possible in semiconductor design. Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five aw...(read more)

Cadence Recognized Among Fast Company’s Next Big Things in Tech 2026

2026-10-07T16:30:00Z

Fast Company has named Cadence to its 2026 Next Big Things in Tech Awards list, particularly recognizing it as one of the 6 Next Big Things in Computing, Chips, and Foundational Technology. This recognition is an acknowledgment of the work we do eve...(read more)

Trusted Autonomy with Cadence Super Agents & NVIDIA Open Agent Safety Platform

2026-09-28T09:00:00Z

Cadence AI Super Agents bring engineering trusted autonomy to semiconductor workflows, enabled by NVIDIA Open Agent Safety Platform. Autonomous engineering is no longer about whether AI can reason about chip design. The harder question is whether tha...(read more)

15 Years of Trust: Honda, Cadence, and the Future of CFD

2026-09-24T14:30:00Z

What does it take to transform promising research into simulation technology that engineers can trust with their real-world development decisions? For Honda and the Cascade Technologies team, now part of Cadence, the answer extended beyond algorithms...(read more)

Accelerating AI Silicon Design with AI-Driven Flows

2026-09-09T08:10:00Z

AI silicon complexity is rising faster than engineering teams can scale with traditional workflows. As designs push into advanced nodes, chiplets, and 3D-IC architectures, how these designs are developed, optimized, and converged become crucial. It i...(read more)

Accelerate Chip Design with Arm Architecture: Cadence EDA Tools on AWS Graviton

2026-09-08T13:00:00Z

Cadence has qualified its full EDA flow on Arm-based AWS Graviton CPUs, and Annapurna Labs is already using the digital implementation and signoff portion in production. The semiconductor industry is entering a new phase, defined by AI-scale comple...(read more)

Advanced AI Scaling with 3D-IC and Heterogeneous Integration

2026-09-01T20:15:00Z

As AI and high‑performance computing (HPC) designs advance at leading-edge nodes, design innovation is increasingly extending beyond individual dies to multi‑die and heterogeneous integration enabled by 3D‑IC technologies. However, moving beyond trad...(read more)

OLogic: Engineering Smarter Robots and Edge AI Devices with Cadence

2026-08-27T16:00:00Z

As AI moves beyond the cloud and into robots, smart appliances, and connected devices, engineering teams face growing challenges in designing compact, high-performance hardware. OLogic, a product development company with deep expertise in electronics...(read more)