Corporate News

Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution

2026-07-31T23:00:00Z

Today, AI infrastructure is driving a fundamental shift in semiconductor design. Delivering the next generation of AI systems requires more than advanced process technology; it demands seamless integration across chiplets, 3D-ICs, advanced packaging...(read more)

AI Semiconductor Design at 3nm and 2nm: Silicon-Proven IP

2026-07-30T20:20:00Z

As AI workloads scale in size, complexity, and performance requirements, delivering advanced‑node silicon becomes increasingly demanding, as there is little room for uncertainty. Semiconductor teams must move faster while minimizing risk, as advanced...(read more)

HPE: Designing Data Centers for AI at Scale

2026-07-30T15:30:00Z

One of the biggest inefficiencies in modern data centers is the disconnect between IT systems and the physical facility. Servers, storage, and networking are often managed separately from cooling, power, and space planning. As a result, many data cen...(read more)

Cadence Certifies AI-Driven Reference Flows for Intel 18A-P and Intel 14A

2026-07-27T13:05:00Z

The expanded Cadence-Intel Foundry collaboration delivers silicon-proven digital and custom design enablement, advanced packaging support, and power delivery-optimized flows for AI, HPC, mobile, and future aerospace applications. Cadence's AI-driven ...(read more)

The Autonomous Chip-to-System Engineer Has Arrived

2026-07-27T01:00:00Z

How Cadence, in collaboration with NVIDIA, is building the industry's first silicon-to-system agentic AI engineering platform For decades, the semiconductor industry has tackled growing complexity the same way: add more engineers, throw more compute ...(read more)

Cadence’s Agentic AI Design Vision Takes Center Stage at DAC

2026-07-22T21:00:00Z

AI infrastructure demands are changing what semiconductor design must solve. The challenge is no longer only about creating faster silicon; it is about designing complete systems where silicon, advanced packaging, PCB, power delivery, thermal behavi...(read more)

Jilin University Accelerates Student Racing Success Using Fidelity CFD Software

2026-07-21T13:30:00Z

Founded in 1955, the College of Automotive Engineering at Jilin University has a long tradition of developing automotive talent. That commitment extends beyond the classroom through its student racing program, established in 2007, which has become on...(read more)

The Three Phases of AI Adoption

2026-07-16T00:50:00Z

Artificial intelligence is often discussed as if the industry is moving through a single technology cycle. But AI adoption is not unfolding as a single event; it is unfolding in waves. The first phase of AI adoption, infrastructure AI, is already res...(read more)

The Three-Layer Cake: The Foundation Behind Intelligent Engineering

2026-07-16T00:45:00Z

Artificial intelligence is rapidly becoming the engine behind the next era of technology innovation. From hyperscale data centers and autonomous systems to robotics and scientific discovery, AI is expanding into nearly every industry. Yet many discu...(read more)

Design for AI and AI for Design

2026-07-16T00:30:00Z

The semiconductor industry is experiencing a once-in-a-generation transformation. Recent projections suggest the semiconductor market could approach $2 trillion by 2030, driven by the rapid rise of AI and the growing demand for intelligent computing...(read more)

AI Infrastructure Starts Beyond the Chip

2026-07-15T22:35:00Z

Why Advanced Packaging and PCB Design Have Become the Next Frontier of Innovation For much of the AI revolution, competitive advantage has been measured by one metric: building faster chips. Every breakthrough in foundation models has driven demand ...(read more)

How the New ASK AI Assistant Makes Support More Seamless

2026-07-14T03:30:00Z

Finding the right answer often takes more than one question. Users may start with a broad query, add details, clarify the issue, or ask a related follow-up before reaching what they need. The new ASK AI Assistant is designed for this kind of natural...(read more)

How Cadence and TSMC Are Accelerating AI Silicon Design at Advanced Nodes

2026-07-13T00:22:00Z

Designing AI silicon for increasing AI/HPC workloads at advanced nodes has become one of the toughest challenges in the semiconductor industry. Escalating goal-driven PPA, reliability, and productivity-optimization demands are converging as developme...(read more)

Finding What Truly Moves You: Honoring Alberto Sangiovanni-Vincentelli

2026-06-24T16:00:00Z

"Finding what truly moves you is happiness. Success is measured in the lasting impact of your ideas." Alberto Sangiovanni-Vincentelli's words offer a fitting reflection of a career defined by vision, leadership, and enduring impact on t...(read more)

Accelerating Drug Discovery with Agentic AI and Computational Science

2026-06-23T13:05:00Z

By Louis Culot, corporate vice president and general manager, Cadence Molecular Sciences (OpenEye) We recently discussed the rise of the autonomous engineer—the transition from human-driven to human-supervised workflows in semiconductor design ...(read more)