Corporate News

How Cadence and TSMC Are Accelerating AI Silicon Design at Advanced Nodes

Corporate — Mon, 13 Jul 2026 00:22:00 GMT

Designing AI silicon for increasing AI/HPC workloads at advanced nodes has become one of the toughest challenges in the semiconductor industry. Escalating goal-driven PPA, reliability, and productivity-optimization demands are converging as developme...(read more)

The Three Phases of AI Adoption

Corporate — Thu, 25 Jun 2026 14:30:00 GMT

Artificial intelligence is often discussed as if the industry is moving through a single technology cycle. But AI adoption is not unfolding as a single event; it is unfolding in waves. The first phase of AI adoption, infrastructure AI, is already res...(read more)

Finding What Truly Moves You: Honoring Alberto Sangiovanni-Vincentelli

Corporate — Wed, 24 Jun 2026 16:00:00 GMT

"Finding what truly moves you is happiness. Success is measured in the lasting impact of your ideas." Alberto Sangiovanni-Vincentelli's words offer a fitting reflection of a career defined by vision, leadership, and enduring impact on t...(read more)

Accelerating Drug Discovery with Agentic AI and Computational Science

Corporate — Tue, 23 Jun 2026 13:05:00 GMT

By Louis Culot, corporate vice president and general manager, Cadence Molecular Sciences (OpenEye) We recently discussed the rise of the autonomous engineer—the transition from human-driven to human-supervised workflows in semiconductor design ...(read more)

Honda + Cadence = Physical AI (part 2): Where Physical AI Will Be Won

Corporate — Mon, 22 Jun 2026 16:00:00 GMT

Hello everyone, I'm Atsushi Ogawa, Center Head of HGR. The real challenge of physical AI ultimately comes back to implementation and verification. No matter how precise a model may be, if it cannot be put into a usable form in the field, it rema...(read more)

The New ASK Portal Brings a Smarter, Faster, and More Intuitive Experience

Corporate — Mon, 22 Jun 2026 11:49:00 GMT

Finding the right support content should be simple, fast, and intuitive. The new ASK portal makes that possible with a refreshed experience designed to help users get to answers faster, learn more efficiently, and make every interaction more product...(read more)

The Three-Layer Cake: The Foundation Behind Intelligent Engineering

Corporate — Thu, 18 Jun 2026 14:30:00 GMT

Artificial intelligence is rapidly becoming the engine behind the next era of technology innovation. From hyperscale data centers and autonomous systems to robotics and scientific discovery, AI is expanding into nearly every industry. Yet many discu...(read more)

Honda + Cadence = Physical AI (part 1): What Does “Physical AI” Really Mean?

Corporate — Mon, 15 Jun 2026 23:00:00 GMT

Hello everyone, I'm Atsushi Ogawa, Center Head of HGR. The more widely the term "physical AI" spreads, the simpler the question becomes: Can AI truly move in the real world? Mr. Anirudh Devgan, CEO of Cadence, described physical AI as a "three-layer...(read more)

Design for AI and AI for Design

Corporate — Thu, 11 Jun 2026 14:30:00 GMT

The semiconductor industry is experiencing a once-in-a-generation transformation. Recent projections suggest the semiconductor market could approach $2 trillion by 2030, driven by the rapid rise of AI and the growing demand for intelligent computing...(read more)

Cadence CEO Outlines the Path to the CMOS 2.0 Era at IMEC ITF World 2026

Corporate — Thu, 21 May 2026 15:00:00 GMT

At this year's ITF World 2026 in Antwerp, Belgium, global technology leaders gathered to discuss one of the industry's defining questions: how semiconductor innovation continues to scale in an era increasingly shaped by artificial intelligenc...(read more)

Welcoming EMA Design Automation and FlowCAD to Cadence

Corporate — Wed, 20 May 2026 16:00:00 GMT

We're excited to share that the EMA Design Automation and FlowCAD teams have joined our Electronic System Design and Analysis Group, bringing together industry-leading PCB design technology with a trusted source of electronic component data. EMA...(read more)

ams OSRAM: Lighting the Path Forward with Intelligent Sensing

Tanushri Shah — Thu, 07 May 2026 16:00:00 GMT

For more than a century, ams OSRAM has stood at the forefront of light and sensor innovation. What began as a pioneering effort in illumination has evolved into a global leadership position at the intersection of optics, sensing, and advanced semicon...(read more)

2.5D + 3D = “3.5D”!

Reela Samuel — Tue, 05 May 2026 15:00:00 GMT

Architecting the Next Generation of AI Silicon The semiconductor industry is no longer defined solely by transistor scaling. As Moore's law decelerates, advanced packaging has become the primary lever for achieving system-level performance gains...(read more)

From the Frontlines of Agentic AI EDA: Accelerated by the Arm Computing Era

ShrutiAnand — Wed, 22 Apr 2026 03:00:00 GMT

A Report from CadenceLIVE Silicon Valley 2026 CadenceLIVE Silicon Valley 2026 opened with a high‑signal punch: a keynote fireside chat between Cadence CEO Anirudh Devgan and NVIDIA® CEO Jensen Huang, followed immediately by Devgan's visionary...(read more)

CadenceLIVE Wrap-Up: Where AI, Chiplets, and System Design Converged

Veena Parthan — Fri, 17 Apr 2026 18:15:00 GMT

CadenceLIVE Silicon Valley 2026 has come to a close. What unfolded over the course of the event was a focused exploration of where semiconductor design is headed—one shaped by AI-driven workflows, advanced packaging, and system-level...(read more)