Corporate News

Helping Physical AI See the Unseen: How EYE4NIR Is Advancing SWIR Imaging

Tanushri Shah — Thu, 20 Aug 2026 16:00:00 GMT

Imagine driving through dense fog yet being able to see clearly beyond what the human eye can detect. That's the vision behind EYE4NIR, a company developing innovative imaging technology that combines visible and short-wave infrared (SWIR) sensin...(read more)

Honda + Cadence = Physical AI (part 3): Creating a Chip the World Has Never Seen

Corporate — Wed, 19 Aug 2026 15:00:00 GMT

Hello everyone. I'm Kentaro Komori, an engineer in the Semiconductor Research at HGR. In this article, I'd like to introduce Cadence that is our design partner and make the development of next-gen AI chip chips for physical AI. In the age of...(read more)

See AuraStack AI Super Agent in Action!

Reela Samuel — Tue, 18 Aug 2026 14:30:00 GMT

Modern AI systems are pushing electronic design into a new phase of complexity. High-bandwidth memory, advanced packaging, dense power delivery networks, and high-speed interconnects require engineers to optimize electrical, thermal, mechanical, and ...(read more)

DAC 2026 Wrap-Up: AI-Powered Engineering Moves from Vision to Workflow Reality

Corporate — Fri, 07 Aug 2026 15:00:00 GMT

Every year, Design Automation Conference (DAC) brings big announcements, packed demos, and deep technical conversations—and this year at DAC 2026, the inflection point was AI moving from point-task assistance to workflow-level autonomy. Across ...(read more)

Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution

Corporate — Fri, 31 Jul 2026 23:00:00 GMT

Today, AI infrastructure is driving a fundamental shift in semiconductor design. Delivering the next generation of AI systems requires more than advanced process technology; it demands seamless integration across chiplets, 3D-ICs, advanced packaging...(read more)

AI Semiconductor Design at 3nm and 2nm: Silicon-Proven IP

Corporate — Thu, 30 Jul 2026 20:20:00 GMT

As AI workloads scale in size, complexity, and performance requirements, delivering advanced‑node silicon becomes increasingly demanding, as there is little room for uncertainty. Semiconductor teams must move faster while minimizing risk, as advanced...(read more)

HPE: Designing Data Centers for AI at Scale

Tanushri Shah — Thu, 30 Jul 2026 15:30:00 GMT

One of the biggest inefficiencies in modern data centers is the disconnect between IT systems and the physical facility. Servers, storage, and networking are often managed separately from cooling, power, and space planning. As a result, many data cen...(read more)

Cadence Certifies AI-Driven Reference Flows for Intel 18A-P and Intel 14A

Corporate — Mon, 27 Jul 2026 13:05:00 GMT

The expanded Cadence-Intel Foundry collaboration delivers silicon-proven digital and custom design enablement, advanced packaging support, and power delivery-optimized flows for AI, HPC, mobile, and future aerospace applications. Cadence's AI-driven ...(read more)

The Autonomous Chip-to-System Engineer Has Arrived

Corporate — Mon, 27 Jul 2026 01:00:00 GMT

How Cadence, in collaboration with NVIDIA, is building the industry's first silicon-to-system agentic AI engineering platform For decades, the semiconductor industry has tackled growing complexity the same way: add more engineers, throw more compute ...(read more)

Cadence’s Agentic AI Design Vision Takes Center Stage at DAC

Corporate — Wed, 22 Jul 2026 21:00:00 GMT

AI infrastructure demands are changing what semiconductor design must solve. The challenge is no longer only about creating faster silicon; it is about designing complete systems where silicon, advanced packaging, PCB, power delivery, thermal behavi...(read more)

Jilin University Accelerates Student Racing Success Using Fidelity CFD Software

Tanushri Shah — Tue, 21 Jul 2026 13:30:00 GMT

Founded in 1955, the College of Automotive Engineering at Jilin University has a long tradition of developing automotive talent. That commitment extends beyond the classroom through its student racing program, established in 2007, which has become on...(read more)

The Three Phases of AI Adoption

Corporate — Thu, 16 Jul 2026 00:50:00 GMT

Artificial intelligence is often discussed as if the industry is moving through a single technology cycle. But AI adoption is not unfolding as a single event; it is unfolding in waves. The first phase of AI adoption, infrastructure AI, is already res...(read more)

The Three-Layer Cake: The Foundation Behind Intelligent Engineering

Corporate — Thu, 16 Jul 2026 00:45:00 GMT

Artificial intelligence is rapidly becoming the engine behind the next era of technology innovation. From hyperscale data centers and autonomous systems to robotics and scientific discovery, AI is expanding into nearly every industry. Yet many discu...(read more)

Design for AI and AI for Design

Corporate — Thu, 16 Jul 2026 00:30:00 GMT

The semiconductor industry is experiencing a once-in-a-generation transformation. Recent projections suggest the semiconductor market could approach $2 trillion by 2030, driven by the rapid rise of AI and the growing demand for intelligent computing...(read more)

AI Infrastructure Starts Beyond the Chip

Corporate — Wed, 15 Jul 2026 22:35:00 GMT

Why Advanced Packaging and PCB Design Have Become the Next Frontier of Innovation For much of the AI revolution, competitive advantage has been measured by one metric: building faster chips. Every breakthrough in foundation models has driven demand ...(read more)