<?xml-stylesheet type="text/xsl" href="https://community.cadence.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/"><channel><title>How Do 3D-IC Designs Make More Than Moore a Possibility?</title><link>/cadence_blogs_8/b/corporate-news/posts/how-3d-ic-designs-make-more-than-moore-a-possibility</link><description>With applications such as metaverse, autonomous driving, and high-performance computing (HPC), the demand for processors that can handle compute and provide high performance is increasing. Chip designers and OEMs have been using scaling to enhance th</description><dc:language>en-US</dc:language><generator>Telligent Community 12</generator></channel></rss>