/cadence_blogs_8/b/corporate-news/posts/cadence-and-intel-foundry-collaborate-to-enable-heterogeneous-integration-with-emib-packaging-technologyCadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(leten-USTelligent Community 12