/cadence_blogs_8/b/corporate-news/posts/guc-tapes-out-complex-3d-stacked-die-design-on-advanced-finfet-node-using-cadence-integrity-3d-ic-platformGlobal Unichip Corporation (GUC), a leading global ASIC provider, has successfully taped out a complex 3D stacked die design on an advanced FinFET node process. The design, which involves a memory-on-logic configuration achieved with a wafer-on-waferen-USTelligent Community 12