<?xml-stylesheet type="text/xsl" href="https://community.cadence.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/"><channel><title>Dream Chip, Cadence Unveil Automotive SoC with Tensilica IP at embedded world &amp;#39;25</title><link>/cadence_blogs_8/b/corporate-news/posts/dream-chip-cadence-unveil-automotive-soc-with-tensilica-ip-at-embedded-world-25</link><description>At embedded world 2025 in Nuremberg, Germany, from March 11 to 13, Cadence and Dream Chip Technologies GmbH will showcase Dream Chip&amp;#39;s new intelligent automotive system on chip (SoC). This powerful second-generation silicon integrates Cadence&amp;#39;s high.</description><dc:language>en-US</dc:language><generator>Telligent Community 12</generator></channel></rss>