<?xml-stylesheet type="text/xsl" href="https://community.cadence.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/"><channel><title>CadenceLIVE Wrap-Up: Where AI, Chiplets, and System Design Converged</title><link>/cadence_blogs_8/b/corporate-news/posts/cadencelive-day-1-wrap-up-where-ai-chiplets-and-system-design-converged</link><description>CadenceLIVE Silicon Valley 2026 has come to a close. What unfolded over the course of the event was a focused exploration of where semiconductor design is headed&amp;mdash;one shaped by AI-driven workflows , advanced packaging , and system-level...</description><dc:language>en-US</dc:language><generator>Telligent Community 12</generator></channel></rss>