<?xml-stylesheet type="text/xsl" href="https://community.cadence.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/"><channel><title>Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution</title><link>/cadence_blogs_8/b/corporate-news/posts/samsung-foundry-and-cadence-expand-infrastructure-and-physical-ai-solution</link><description>Today, AI infrastructure is driving a fundamental shift in semiconductor design. Delivering the next generation of AI systems requires more than advanced process technology; it demands seamless integration across chiplets , 3D-ICs , advanced packaging</description><dc:language>en-US</dc:language><generator>Telligent Community 12</generator></channel></rss>