/cadence_blogs_8/b/corporate-news/posts/advanced-ai-scaling-with-3d-ic-and-heterogeneous-integrationAs AI and high‑performance computing (HPC) designs advance at leading-edge nodes, design innovation is increasingly extending beyond individual dies to multi‑die and heterogeneous integration enabled by 3D‑IC technologies. However, moving beyond traden-USTelligent Community 13