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3D IC discussions are creating quite a buzz these days. No conference is complete without a mention of 3D ICs, and there are reasons behind that. 3D ICs using through-silicon vias (TSVs) help you meet challenging performance and power targets to serve the growing demands of the networking, graphics, wireless, and computing industries. And don't forget consumer needs for ultra light and thin devices!
If you have anything to do with memories or with GPUs, or with designing logic to interact with the analog and RF components for the markets I mentioned above, you probably know what I am talking about. If you have not looked at 3D-IC TSV technology yet, it's a good time to do so now.
What's Needed for 3D IC Realization
There are a few technology requirements for 3D IC Silicon Realization:
I began studying this technology years ago wondering if it would ever become real. I remember when a colleague of mine shared an article that he had written 22 years ago that had a mention of 3D ICs. But now I can see that it is real because the need is real and is urgent. Moore's Law is not going anywhere anymore, "more" needs to be done to deal with the CMOS scaling trend, and 3D IC is that "more" right now.
We are seeing a lot of traction at some of our key customers who are now taping out real production chips. 3D IC technology has its share of open challenges, like any other disruptive technology in its early stages, but the performance and power benefits are so huge that it is certainly serving as a differentiating strategy for the few who have dared to walk that path.
So unarguably the race is on.
Are you in it yet? Let me know; let's talk about it. Please let us know if you would like to see the technology in action.
Recent Cadence Community blogs on 3D ICs:
Samta Bansal: My DATE With 3DIC Technology
Rahul Deokar: EDP Symposium Discovers an Inconvenient Truth with a Shot of 3D
Richard Goering: EDA Workshop: A Reality Check on 3D ICs
Rahul Deokar: DAC 2010 - A "Coming Out" Party for 3D-IC Design
Richard Goering: 3D-IC TSV Update: No Technology Roadblocks, But Cost Management is Needed
Recent Webinar on 3D IC Topics:
Should You Design Your Next System With 3D TSVs? Hear from GLOBALFOUNDRIES and Cadence