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VoltusTM IC Power Integrity Solution is a power integrity and analysis signoff solution that is integrated with the full suite of design implementation and signoff tools of Cadence to deliver the industry’s fastest design closure flow. The aim of this blog series is to broadcast the voices of different experts on how design engineers can effectively use the diverse Voltus technologies to achieve high-performance, accuracy, and capacity for next-gen chip designs.
We know from experience that collaboration is absolutely essential for the efficient functioning of any team, with every member’s expertise contributing to achieving a shared objective. Such collaboration is no longer limited to humans but now extends to the participation and integration of different technologies in order to achieve more challenging goals that exist in this digital age. Think how artificial intelligence (AI), clubbed with cloud computing, is changing the dimensions of existing technology. AI capabilities in the cloud computing environment are playing a crucial role in making business operations more efficient, strategic, and insight-driven, while also providing additional flexibility, agility, and cost reductions.
So, how do we apply such technology integrations in our processes and tools to overcome demanding design challenges and innovate faster? To answer this question here is the ‘Chip-2-System Power Signoff’ video series. The series shows precisely how Cadence provides a highly integrated “full-flow” environment to achieve faster design closure and optimal results.
VoltusTM IC Power Integrity Solution is tightly integrated with six different Cadence tools at the different stages (digital, signoff, custom, verification, and IC package) of a design life cycle, providing a complete design and implementation solution. On its own, Voltus is a cloud-ready, full-chip, cell-level power signoff tool that provides accurate, fast, and high-capacity analysis and optimization technologies on a power delivery network (PDN) of a chip. But the productivity gains increase even further when it is integrated with the wide breadth of key Cadence products.
The 'Chip-2-System Power Signoff' video series gives deeper insight into the goals and advantages of these integrations. The first video in the series is about the Voltus-Sigrity X integration. This integration solution enables designers to analyze system-level EMIR, resulting in seamless co-design and co-analysis of three domains—chip, package, and board.
The key features of this integration are:
You can learn more about these features with the Voltus-Sigrity X integration video and explore how the Voltus-Sigrity X integrated solution can help overcome the challenges that arise when working with advanced packaging technologies.
This integration video will help you:
Such an integrated and collaborative technology will surely help design engineers face the challenges of a constantly evolving advanced packaging technologies landscape, giving them the efficient design tools that are needed to achieve power integrity signoff success.
Do watch this first video of the ‘Chip-2-System Power Signoff’ video series to explore the solutions that these integrations offer at the different stages of a design lifecycle.
Stay tuned for more videos in the series!
Voltus - Sigrity Package Analysis (SPA) RAK
IR-Drop Analysis of a Mixed-Signal Design RAK
3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hierarchical Analysis
For more information on Cadence digital design and signoff products and services, visit www.cadence.com/go/voltushs.
“Voltus Voice” showcases our product capabilities and features, and how they empower engineers to meet time-to-market goals for the complex, advanced-node SoCs that are designed for next-gen smart devices. In this monthly blog series, we also share important news, developments, and updates from the Voltus space.