Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
Verification Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Get email delivery of the Cadence blog featured here
Calif.—You can feel the impact of the Internet of Things (IoT) in your bones,
like a relentless hum. You already know what the mobile revolution has done to
society and the electronics business, much of that just in recent years.
So you can
envision what IoT (or as Alberto
Sangiovanni-Vincentelli calls "the swarm") will do in an even
shorter period of time.
integration, power, and cost loom as potent challenges. The conversation today
surrounds what 16nm
finFET and beyond will do to enable the explosion of a vast market of
Lees, senior vice president and general manager for microcontrollers with
Freescale, sees something different—something more attainable right now.
keynoted Cadence's Mixed-Signal Technology Summit (Oct. 10) believes that 28nm
and the sunk investment in the node in the past five years is the catalyst for
juicing that market and tackling the cost, integration, and power issues without
waiting for FinFETs and the expensive infrastructure buildout associated with them.
While cost for
20nm, 16nm, and 14nm FinFET nodes "is going off the scale," the same was not
true for 28nm compared with the 40nm node.
Lees told the
"In our opinion, from the user side,
a huge amount of the foundry space, particularly in 40 and 28 capacity built in
the last five years—mostly equipment installed into later generation 300mm
facilities—will be converted to 28nm. We see an enormous overhang of 28nm
capacity for the next 15 years."
there's a perfect opportunity to take the time to develop the "richness of
analog and RF technologies" and to have "useful time for integration
without that node skipping to the next process node two or three years later,
requiring the whole mixed-sgnal ecosystem being redone again."
could say that 28nm is the last simple node," he added.
What will this
enable? It will enable approaches (pictured
in the photo) of integrated modules for edge nodes, which need robust communications protocols, bullet-proof durability, and ultra-low power
power will need to be increased exponentially, on-chip RAM needs to rise from
16-20Kbytes to 300-500Kb, the "minimum level" needed for full
security, Java, network compliance, specs, profiles, and drivers, and with
something up to 1MB of non-volatile memory, Lees said. Neither 40nm nor 65nm
nodes is capable of this level of performance and potential integration.
where we feel the richness of mixed-signal integration. The longevity of that
node will allow us to create those products," Lees said.
The 28nm node
is also where MEMS integration gets more traction. Lees showed a slide
describing a 2x2x0.5mm module that was a full 32-bit MCU. It featured 40mA/MHz of dynamic power, ultra-low standby power (down to nano-amps in deep
sleep), mixed-signal integration to 12 bit, and an integrated temp sensor that
could be calibrated to 16 bit. The 60 percent mixed-signal device would have
been at least one board 15 years ago, Lees noted.
Forum: 16nm FinFET Design Challenges Met by Custom/Analog Reference Flow
2013: Wild ride through the mind of Alberto Sangiovanni-Vincentelli