Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
System Development Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Get email delivery of the Cadence blog featured here
Right up there with functional verification, the challenges of low power design and verification present an existential threat to our customers' products, and ultimately their businesses. Clearly both sides of the low power coin -- reducing generated heat and/or increasing efficiency to make the most of every available joule -- are of primary concern. But what happens when external, environmental factors conspire to betray even the best low power electrical design? In the case of the GoPro "Hero2" camera, ironically the device's waterproof housing that has help propel this amazing system to some incredible heights can sometimes undermine its operational performance in certain corner cases.
First, let me describe the system setup. As shown in the image below, the GoPro Hero2 camera is the little cube on the left. In the middle is the (empty) polycarbonate protective housing that's gasketed to keep out water and dirt. On the right the camera is sealed inside the housing.
As per this video I shot exclusively with GoPro Hero2 this summer, I can personally attest that the camera and housing make for a very solid and effective mechanical system. (If the embedded video doesn't play, click here.Overall the camera performed brilliantly. However, there was one issue that emerged: whenever the camera got too hot it would automatically shut down to avoid damaging itself. For example, when the system is in direct sunlight the housing seems to act like a greenhouse and/or it insulates the camera such that the camera heats up significantly faster than when it's out of the housing (especially on an already hot summer day). So while I praise the Hero2's designers for building-in this automatic fail safe, at the same time it's frustrating to wait for the camera to cool down. (FYI, keeping the system submerged in the pool, or putting it in a cooler with the drinks and snacks expedites the turnaround process. But I digress ...)
What are the lessons for EDA here? I see three:
* The need to model "out of band" behaviors in the digital design domain - i.e. consideration of expected environmental factors in addition to the device's specified logic and firmware performance - will need to become more prevalent as our customers develop more devices destined for mobile use.
* Electronic Design Automation (EDA) will need to get even closer to Mechanical Design Automation (MDA). I know my colleagues in PCB design and IC packaging are well down this road, but this GoPro case study suggests that SystemC/RTL design and verification must also consider macro-level physical factors as well. Beyond today's UVM Low Power flows, should there be a "UVM Thermal Behavior" verification flow?
* Last but not least, the general moral of this story is that as far as we've come, collectively the EDA industry has a ways to go before our innovations make low power one of our customers' lower priorities.
Joe Hupcey III
On Twitter: http://twitter.com/jhupcey, @jhupcey
P.S. For fellow parents:Chances are you have probably heard of GoPro cameras before, but might have dismissed them as being only for young adventurers. Certainly GoPro supports such customers and their extreme sports very well. However, I quickly realized that this camera and its ruggedized shell is as effective for capturing my constantly on-the-go daughter's activities as it is for motor sports and outdoor adventures. Since I'm constantly asked about the Hero2 system by other parents, allow me to anticipate the question "Does the GoPro ‘work' for capturing family-style activities?" with a hearty "Yes". In a nutshell, it's a perfect second camera for the many times where you would rather avoid subjecting your "regular" camera (be it a cell phone camera, point&shoot, DSLR, or camcorder) to rigors and risks of family-oriented activities like swimming, bicycling, rainy hikes, and winter sports.