Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.
Verification Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
More Support Log In
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technology. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Get email delivery of the Cadence blog featured here
A recent decision by TSMC to require model-based design for manufacturability (DFM) checks at 45/40 nm may push DFM into more widespread use. It’s coming too late for the several dozen DFM startups that were around a few years ago, but it could have a significant impact on IC design flows going forward.
At 45/40 nm, TSMC mandates that users run a lithography process check (LPC) and virtual chemical/mechanical simulation (VCMP). The VCMP requirement is waived for blocks less than 1 mm2. LPC and VCMP were recommended, rather than mandatory, at 65 nm and above. For rule-based DFM, layout parameter extraction (LPE) is a new requirement at 45/40 nm.
Rule-based recommendations and mandates have been around for years, but model-based DFM is relatively new – and it’s been an area of intense focus for established EDA providers and startups alike. Without foundry requirements, however, adoption has not been as fast as some might have expected. Model-based checks typically include LPC, CMP, and critical area analysis (CAA).
Why the change from recommended to mandatory for LPC and VCMP? Tom Quan, deputy director of design methodology and service marketing at TSMC, said that TSMC has been running its own model-based checks at 65 nm and above, and working with customers to fix any problems that arise. “We think that might not be doable [at 45/40 nm] given the complexity of some of the designs that are coming in, and we want to make sure the customer will do some level of model-based checking beforehand,” he said. “Rules are getting so complex that there is no way the customer can use a complete rule-based solution.”
The growing complexity of unrestricted layout patterns has also led to the requirement for LPC and VCMP checks, Quan said. But CAA is still recommended rather than required at 45/40 nm, he said, because “systematic and random defects at 40 and 45 nm are under good control.”
Unlike TSMC, Chartered does not mandate model-based DFM checks at 45 nm. “However,” said Walter Ng, vice president of design enablement alliances at Chartered, “we have noticed that more customers designing at 45 nm and below are more proactive in taking up DFM.” Chartered recommends model-based checks and has used them with some customers and with library and IP partners.
Manoj Chacko, director of product marketing for DFM and extraction at Cadence, said he’s noticed an increase in customer inquiries about model-based DFM beginning early this year. “40 nm customers are asking what the tools offer and are saying they need model-based DFM,” he noted.
Quan noted that mandatory checks today may not always be mandatory. Over time, some could go back into the “recommended” column as more experience is gained with the process. Further, restricted design rules (RDRs) may moderate the need for model-based DFM in the future. TSMC doesn’t have RDRs at 45 nm, but expects to have some at 32 and 28 nm. “If you have a lot of patterns you don’t need to worry about, it could mean that the model-based approach doesn’t have to become more complex,” he said.
TSMC customers have two options for meeting the model-based DFM mandates. First, they can use commercial tools such as the Cadence Litho Physical Analyzer (LPA), Cadence Litho Electrical Analyzer (LEA), and Cadence CMP Predictor (CCP). Secondly, they can use TSMC’s on-line DFM service. Quan said the service can be cost-effective for small customers, but it requires customers to wait a few days while TSMC runs the checks. Larger customers who already have EDA tool licenses will probably use their own tools, he said.
One way or another, it appears that model-based DFM is finally moving from the “talking” stage to becoming a necessary part of the IC design flow.