Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.
Verification Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
More Support Log In
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technology. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Get email delivery of the Cadence blog featured here
If you want low-power, high-bandwidth access to off-chip DRAM, you're going to have to do some creative design work. A recent video presentation provides a good overview of some of the challenges, and shows how more intelligent memory controller and PHY IP is needed to support next-generation standards such as DDR4, LPDDR3, and Wide I/O.
The presentation is titled "DDR4, LPDDR3, and Wide I/O -- How Design IP Meets the Needs of Next Generation High Bandwidth, Low Power Memory." It was presented by Marc Greenberg, product marketing director at Cadence, as part of the IP Talks! series at the Design Automation Conference (DAC 2012) at the ChipEstimate.com booth.
Greenberg started the 20-minute talk by noting seemingly conflicting demands. Most applications use off-chip DRAM because the cost per bit is much lower than on-chip memory. However, moving away from the CPU results in longer access times. Meanwhile, applications from smartphones to tablets and PCs are demanding faster bandwidths. Standards such as DDR4, LPDDR3 and Wide I/O will help, but substantial changes are required in the memory controllers and PHYs that provide the connection to off-chip DRAM.
In a modern SoC, Greenberg noted, a single DRAM resource is shared across a number of clients. Low latency is needed for critical transactions, and high bandwidth is needed for large transfers. One way the controller can manage all this, and still ensure peak performance, is by reordering transactions so that gaps between them are shorter. Greenberg showed an example in which Cadence memory controller IP provided a 30% performance improvement by reordering transactions.
Other important memory controller capabilities include low-power access modes to control DRAM power, a "broad and rich feature set" to meet the needs of a variety of users, and improved priority reordering to create longer queues without increasing latency. Greenberg noted how Cadence provides both low-power and high-performance PHYs. He also observed that controllers and PHYs aren't enough - there's also a need for verification IP (VIP) and a board-level system integration kit.
Greenberg spoke enthusiastically about the promises of Wide I/O DRAM in conjunction with 3D-ICs with through-silicon vias (TSVs). "By using TSV-based memories, we can improve the number of connections between dies by about 10X," he said. "It's easily possible to have 1,000 to 2,000 connections between any two dies connected together using microbumps. The bandwidth between those dies can be increased by up to 10X, and there's a 6X reduction in capacitance per connection." He noted, however, that Cadence had to make "quite a few changes" to its DRAM controller to support Wide I/O.
To view the video, click here (ChipEstimate.com log-in may be required) or click on the icon below. For more information about Cadence design IP solutions, click here.