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I’ve been going to Mobile World Congress in Barcelona for over 10 years, and it never fails to amaze me. This year’s theme is “Creating a Better Future” and I can’t think of a better theme for Cadence – our Tensilica® processor IP is used for just that! Our IP adds the sound, image processing, neural networks - the complex digital signal processing that differentiates tomorrow's products.
Book a meeting now to meet with the right people when you visit the Cadence® booth at Fira Gran Via, hall 6, stand 6L34, from February 26 to March 1. Book at meeting or just stop by – look for me and say hello. I’ll be happy to give you a tour of our demos.
While we have a wonderful booth with plenty of demos, the real action goes on in our four meeting rooms. If you’re going, have you signed up yet? You can book your own meeting here.
You’ll have the opportunity to view exciting demonstrations of our latest technologies, discuss your plans and requirements for on-device artificial intelligence (AI)/neural networks, imaging and computer vision, audio, radar/lidar, communications and other DSP-based products, and meet with key Cadence business and technology leaders. Find out how Tensilica DSPs can make an impact in your next SoC design, giving you the highest performance and lowest power while creating a better future for the world.
AI and Vision
Request an appointment. See you there! See how crowded our booth was last year.