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blog was written by a guest blogger – Mark Beesley of AT&S. His company is a global leader in supplying advanced interconnect solutions to the high-end
electronics sector. AT&S leads
HERMES, a European consortium focused on developing the supply chain for
embedded components in PCB and IC Packaging.
“You’re only as good as your last product …”
consumers are pretty hard judges, aren’t we?
No matter how many man-years go into the development of a new product,
it is put on sale and judged on its relative merits … looks, feel, performance
and yes of course affordability…compared to a myriad of other brands, models, and devices from dozens of manufacturers.
it is fair.
all have the same opportunity to take what is in front of us and create our
best-ever product, and we know that the market will decide.
why it’s a good time to take a look at the emerging use of technologies that
break barriers, combine functions and offer quantum steps in performance. Imagine being able to step change
miniaturization, improve reliability, and reduce supply chain complexity and
overall cost with one decision?
a potential game-changing technology is embedded die in laminate (for example, AT&S’s
latest major technology innovation, ECP® ), and there are reasons why now is the
right time to consider it as a viable packaging solution. First of all – the
challenges in the Design environment are being solved. Yes, we have to worry about the
semiconductor, the IC substrate and the PCB all in one package but thankfully
we have tools like Cadence’s Allegro (v16.5) to help out.
Secondly, the design benefits start to dramatically outweigh the risks with using a new
until now, the miniaturization opportunity did not justify the challenges in
the design and supply chain. Taking this
simple balance of pros versus cons, it simply was never going to take off. Something had to change. That’s why, when AT&S set up the production
fab for its advanced ECP packaging operation, an investment in going beyond the state-of-the-art
capability was the focus. With the
latest High Density Interconnect (HDI) capabilities and the obsession with
highest possible yields, AT&S has managed to overcome the entry hurdles and
released ECP in to the commercial market – with first products demonstrating ground-breaking
advances in SiP (System in Package) form factor and performance.
see the market demands for the next steps in miniaturization, for unbreakable
products and for cost-effective eco-friendly technologies, and we
believe that ECP offers solutions to the Designer looking to bring her/his
best ever product to life.
a look at the ECP®
technology on our website or e-mail our Product Management team (firstname.lastname@example.org) for more details.
feel free to comment on your exploration and experience with embedded
technology in PCB or IC Packaging.