Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.
Verification Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
More Support Log In
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technology. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Get email delivery of the Cadence blog featured here
The Cadence user group event in Silicon Valley, CDNLive SV 2014, had a number of different focused topic tracks at the event. For the complete two day agenda, click here.
Track 6, the IC Packaging/SI, PI featured customer papers on co-design as well as signal and power integrity. With the challenges of faster speeds, denser designs, and lower product costs permeating the electronics industry, it is easy to understand why there was an emphasis on 3D full-wave field solvers being utilized in PCB and IC Packaging design and analysis flows.
Cadence® Sigrity® PowerSI 3D EM Full-Wave Extraction Option (3DEM) was featured as a critical part of the design flow in two user papers and also discussed in the Cadence "how-to" paper where we discussed partitioning techniques for single and multi-fabric design challenges.
The first user paper highlighting 3DEM was delivered by Dan Lambalot of Bayside Design where he discussed the methodology used to create a wirebond package that supports 8Gbps data transfers. A number of design techniques were discussed (short wirebond wires, shielding, etc.) and 3DEM was used throughout to verify that the techniques would yield the desired results. To review the Bayside Design paper, click the image below.
Another user paper highlighting 3DEM was delivered by BP Wong of Lattice Semiconductor. BP discussed the challenge of designing high-speed SerDes channels in IC Packages at Lattice, where real estate runs at a premium. He compared the design challenge to landing a fighter jet on an aircraft carrier in rough seas at night. A tool used by pilots dubbed as a "meatball" aids in determining the right approach angle. In BP's case, 3DEM was the tool that aided Lattice in how to trade off differential impedance and common mode impedance to meet critical design goals. For the pilot or for the package designer, BP made the case that the tool itself is only a means to the end. Expertise is required to get a successful result. To review and download the Lattice Semiconductor paper, click the image below.
Concluding the two day event, Cadence Product Engineer, Brad Brim gave us an excellent presentation on how to "divide and conquer" to get the most out of the full-wave 3DEM technology. Also included in Brad's presentation were many tips and tricks on how to successfully extract coupled signal, power, and ground; how to manage multi-fabric simulations; and why it is unusual to have coupling between fabrics. Brad's presentation can be viewed here:
So, CDNLive SV 2014 is behind us, but there will be many more CDNLive events around the globe as the 2014 continues. If you did not make it to CDNLive SV 2014, we hope you can make it to a future CDNLive event.
Please tell us about any of your CDNLive experiences.