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The Cadence user group event in Silicon
Valley, CDNLive SV 2014, had a number of different focused topic tracks at the
event. (See the complete two-day agenda.)
Track 6, IC Packaging/SI, PI, featured
customer papers on co-design as well as signal and power integrity. With the growing challenges of planning and
implementing the latest
generation of multi-gigabit parallel bus interfaces like DDR3 or DDR4, it's
easy to understand the emphasis on cross-fabric interconnect planning to optimize
for performance and cost.
OrbitIO was featured for early cross-fabric
planning in two of the papers with the third session providing a live
demonstration of the flow between OrbitIO and SIP-XL.
The first user paper that highlighted OrbitIO
was delivered by Dr. WangJin Chen of Faraday Technology. Dr. Chen discussed
optimizing interconnect across the die, package, and PCB, and presented a case study illustrating a
reduction in layer count, single layer implementation of DDR interface, and an
overall reduction in cycle-time as result of using OrbitIO. To review the Faraday Technology paper, click the image below.
The second user paper highlighting OrbitIO, delivered by Vincent Hool of Altera, presented a template-based
methodology for bump pattern development for FPGAs. It presented their flow and application of
OrbitIO from early architectural "what-if" planning, through feasibility
analysis, and die abstract data exchange with SIP-XL for final implementation. To review the Altera paper, click the image below.
The final session was a live demonstration by
Cadence Principal Application Engineer Joshua Luo, which showed OrbitIO working
in conjunction with SIP-XL and Encounter as part of a seamless co-design
solution. He showed how the package
definition and route plan generated in OrbitIO is passed via direct integration
to SIP-XL. He then utilized auto-interactive breakout technology to quickly
implement the interfaces. Luo also showed
how the die abstract file is used to exchange silicon-related content with
Encounter in support of bi-directional engineering changes throughout the
planning and implementation process.
CDNLive SV 2014 is behind us, but there will be many more CDNLive events around
the globe as the 2014 continues. If you did not make it to CDNLive SV 2014, we
hope you can make it to a future CDNLive event.