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Are you responsible for the creation and management of a BGA ball map or a die bump map of a packaged chip design? How much time do you spend creating these maps? How do these maps drive physical implementation in your design? It’s common for most companies to use spreadsheets to create the ball map or die bump map of a chip, and if you do, you know how tedious, time consuming, and error prone a process it is. On top of that, it does not even provide a WYSIWYG representation of the pin map!
Well, the good news is that there is an alternative (watch the YouTube video below). The video shows Cadence OrbitIO interconnect designer creating a BGA ball map in just a couple of minutes that feeds directly into an IC package design.
Creating a ball map in OrbitIO is quick and easy, and it even exports a spreadsheet view for reporting and design review.
I have just introduced one of several ball map creation flows available with OrbitIO and viewable on YouTube. If you are interested in learning more, watch the video above, and contact your local Cadence sales representative.