• Home
  • :
  • Community
  • :
  • Blogs
  • :
  • Signal and Power Integrity Analysis
  • :
  • Conquer SI/PI Challenges and Reduce Time to Signoff for…

Signal and Power Integrity Analysis Blogs

  • Subscriptions

    Never miss a story from Signal and Power Integrity Analysis. Subscribe for in-depth analysis and articles.

    Subscribe by email
  • More
  • Cancel
  • All Blog Categories
  • Breakfast Bytes
  • Cadence Academic Network
  • Cadence Support
  • Computational Fluid Dynamics
  • CFD(数値流体力学)
  • 中文技术专区
  • Custom IC Design
  • カスタムIC/ミックスシグナル
  • 定制IC芯片设计
  • Digital Implementation
  • Functional Verification
  • IC Packaging and SiP Design
  • In-Design Analysis
    • In-Design Analysis
    • Electromagnetic Analysis
    • Thermal Analysis
    • Signal and Power Integrity Analysis
    • RF/Microwave Design and Analysis
  • Life at Cadence
  • Mixed-Signal Design
  • PCB Design
  • PCB設計/ICパッケージ設計
  • PCB、IC封装:设计与仿真分析
  • PCB解析/ICパッケージ解析
  • RF Design
  • RF /マイクロ波設計
  • Signal and Power Integrity (PCB/IC Packaging)
  • Silicon Signoff
  • Solutions
  • Spotlight Taiwan
  • System Design and Verification
  • Tensilica and Design IP
  • The India Circuit
  • Whiteboard Wednesdays
  • Archive
    • Cadence on the Beat
    • Industry Insights
    • Logic Design
    • Low Power
    • The Design Chronicles
Sherry Hess
Sherry Hess
7 Jun 2022

Conquer SI/PI Challenges and Reduce Time to Signoff for PCIe 6.0

The peripheral component interconnect express (PCIe) high-speed interface has become the standard interface for computer expansion cards for graphics, solid-state drives, etc. due to its high bandwidth combined with manageable component costs. The latest version 6.0 is on the way, with the PCI Special Interest Group (PCI-SIG) having published the final specs in January 2022. And it promises even faster data rates, which raises new challenges for design engineers as the popular interface standard moves to pulse-amplitude modulation-4 (PAM4) signaling for the first time.

Here, Cadence offers a complete signal integrity (SI) and power integrity (PI)  design and analysis workflow that significantly reduces the time to signoff for PCIe 6.0 devices. Watch this on-demand webinar to learn how design teams utilize the Sigrity X platform for early what-if analysis scenarios at the system level to realize optimized solutions. 

Tags:
  • Sigrity X |
  • Power Integrity |
  • in-design analysis |
  • PCIe |
  • Signal Integrity |
  • system-level optimization |