Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
System Development Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Hi, I'm a newbie.I have some problems with Orcad PCB Designed and thermal relief.I have edited a pad and defined this pad for all the layers:regular pad: circle 60thermal relief: circle 80antipad: circle 80When I create a dynamic shape to create a copper pour region the ray of thermal relief area is always of 5 mills.The part of copper pour between the spokes is only 5mills instead of 10mills [10=(80-60)/2].I have done a lot of attempts, changing pad parameters in the pad designer, but it doesn't workn. The size of the void spaces between the spokes of the thermal relief generated on the positive planes or dynamic shape is always the same.Thanks a lot.Carlo
The thermal relief line width is taken from 1 of the following
1. MIN_LINE_WIDTH property if one is set on the net. e.g. MIN_LINE_WIDTH = 10 MIL.2. The Physical constraint for MIN LINE WIDTH for that net and layer assignment. Look in Constarint Manager under Physical Constraint >All Layers.3. The shape parameter, either an instance based entry or global. Select Shape>Global Dynamic params...Selct the 'Thermal relief connects' tab. You can enter a fixed thermal width or an oversize. If you enter an oversize thermal with it will be added to the min line width specifed by the Physical constraint (#2 above) that that net class uses for line width.If you have a MIN_LINE_WIDTH property it will take precedence over the constraint and shape parameters.The void is derived from the spacing constraint Shape to pin (or via). You more than likely have a 5 MIL spacing constraint for the shape to element spacing set.The thermal and antipad definitions are used when constructing negative layers.
In reply to Rik Lee:
Thanks for your answare.
The problem is about the width of the void space between the spokes.I have set all spacing constraint at 12.00mills for my test, shape to pin and shape to vias too. I have update the dynamic shape but the size is always 5 mills.
I have found these on my book "Complete PCB Design Using OrCAD® Capture and PCB Editor":
Thermal relief connections between plated through holes and copper areas onpositive planes are automatically generated by PCB Editor so flash symbolsneed not be defined for positive layers. The inner diameter (ID) of the thermalrelief is defined by the pad diameter while the outer diameter (OD) is definedby the diameter of the (thermal relief) circle in the padstack definition set inthe Padstack Designer.
If I set a clearance oversize in Shape->Global Dynamic shape Parameters->Clearances Tab, for thru pin at 7mills the width of void space become 12mills(5+7) but the oversize is applied to the other type of pin, without thermal relief.
What is the way to set the size of thermal relief void space between the spokes, without changing the clearence between dynamic shape (copper pour) and the pin connected to the signal nets?
In reply to CarloL:
The spacing between the shape and pin is determined by the value for the 'Thru Pin to Shape Same Net Spacing' in Constraint Manager under Same Net Spacing >All Layers >Shape to <element> in this case the element is Pin.
Thank you very much