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I am creating footprint for some chip, which has exposed pad in the center which must be connected to ground most of the time.
I want to have many vias in that pad.
I do create a 128x128 mil pad, with multiple vias enabled, however; those vias never appear there! Neither they can be observed in 3D view in component layout, nor they can be seen when used in the PCB layout which uses that footprint.
I am attaching two screenshots, one with Parameters tab for Padstack of center pad, another is Layers tab. All parameters seem to be set well, and the pad is being previewd as the one I want it to be in padstack editor, but thats not the way how it is instanitated in Package editor... no vias or bottom layer can be seen there.
Any ideas what else could be missing?
I decided to export the DRL files anyway, and the strange thing is, that in this case there are two .drl files generated 1-4 (layer 1 to 4) and 1-1... the one which is 1-1 is for the PAD of the footprint.
however, even then nothing is displayed on the 3D view, I see something like via, but it does not make it from layer 1 to anywhere.
And to get a complete .drl file, I have to concatenate two drill files produced (one for all holes of design, another for just that footprint).
I believe there have to be a better way to get it done! any ideas?
In reply to Kabal:
OK...well here is what had to be done: On that second picture I posted, tick the:
"suppress unconnected int.pads; legacy artwork"