Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.
Verification Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
More Support Log In
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technology. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
this sounds a silly question. I always specify "THERE SHALL BE A MAXIMUM OF 10 PANELS PER PACKAGE"
in PCB fab note, which is I copied from somewhere. is it reasonable to
make this requirement. is there a requirement in any of the IPC standard.
vendor didn't follow this requirement, and send me a pack with 50
panels. should I increase this number in my next design.
I worked for several companies that had their own in-house assembly operations and on average we had 25 boards/array per package. Our average boards size was 12.5" x 6.5" and 12 to 14 layers. The number per packge would go up as the board/array got smaller. I don't remember what the exact numbers where, it was driven by our internal Fabrication Spec that was supplied to the PCB Vendors.
Overall, it really depends on how many boards/arrays you are going to assembly at one run. Less in a package gives you more flexibility to build smaller quantities without risk of contamination to the remaining boards in the lot once the packaging seal is broken. Sure the assembly house could reseal or repackage the remaining boards but it is always better to not risk any contamination that could be caused by the extra handling, especially if the bare boards are going to be sitting in inventory for a while. (+6 months) Handling a large quantity of boards in one package may be a pain but I think it is more of a risk breaking the seal of the large package to only build a handful of boards/arrays.
My two cents,Mike Catrambone
In reply to mcatramb91:
thank you very much, it is smart to link the package counts to the assembly number.