Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
System Development Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Hello all.3 GND layers: 3, 7 and 11. I want a via to be connected on 3 and 11 but not on 7.using negative shapes.I edit the padstack and change l7gnd "thermal relief"definition from (circle, thermal flash thr_25 size 35) by removing flash thr_25 and keeping circle size 35.The artwork then fails saying: PADSTACKS MISSING THERMAL/ANTIPAD DEFINITIONS: VIA_TEST
... error in film, proceed to next! *** ERROR with l7gnd.art
------------------------------------------------------ SUMMARY: *** ERROR with l7gnd.artDoes pad definition really need a flash in thermal relief definition?It can't be empty?I sometime did the reverse by putting a thermal definition in the antipad to graphically connecting a pad (without any schematic logic). This works well...Thanks in advance.
you can try to edit the Via PadStack and change the thermal flash in I7gnd layer, make it small than the drill size. then nothing in this layer.By the way, I think the good solution is to use the B/B via, Top-3, and Bottom-11.
hi, leonleeI don't think the smaller flash works.I tryed in that way,and i created the artwork of that layer.When I imported it into the CAM350, i found the pad used in that layer was the smaller flash.Compared with the other really unconnected via,whose pad in that layer was the Anti-Pad, the pad we concerned was not succedssfully seperated form the layer.Soooooo,I still wonder how to disconnect a via and a layer in same net.Kepei,tranfa
Don't know what can be done by editing the padstack, but what I've done is use an anti-etch line on the specific layer (shapes don't seem to work). This is an arc'd line that circles around the via center with a width such that the inside edges overlap and the outside edges are the diameter of the anti-pad you want. Only problem is if you ever move or delete that via you also need to remember to move/delete the anti-etch line.
Hello Randy,Once more,I don't think the circle formed by the anti-etch works in a neg layer.In official document, this kind of anti-etch is not surported in a neg layer.I think this puzzle worth disscussing.So anyone familiar with the process of the manufacturing of PCB come up to solve the Sphenx?
What's about using positive layers?So you can add "no_shape_connect" to the via and it will be voided on all layers.To connect this via on a specific layer, just use a cline large enought to fill the void.But i do have any idea with negative layers.
tfsummer,I responded to your previous thread with some extra detail. See link below:http://www.cdnusers.org/Forums/tabid/52/forumid/5/postid/2470/view/topic/Default.aspxI see two options: (which I have used with success in the past)Disconnect a via on one plane layer of the same net Manually add a void on the plane layer around the via which will causes it not to be connected on specific plane layer. This also works on both negative and positive shapes but to further ensure that it stays disconnected I add a ROUTE KEEPOUT to represent the void in the plane. Of course if you are using dynamic shapes the void will be automatically generated on both negative and positive shapes.Disconnect a via on all plane layers of the same net Attach the property NO_SHAPE_CONNECT to the via which will prevent it from being connected to any shape of the same net on all layer. This works on both negative and positive shapes.Hope this helps,Mike CatramboneUTStarcom, Inc.