Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
System Development Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
I have a board that is backwards the major
components are on the bottom side so we want to do the ICT test from
the top of the board. When we change the methodology layer to the top
and the restriction of allow under componenet to bottom layer
only then put in our padstacks for pins which is a top side pad of 35
and for vias it is a 12 drill 35 pad on the top side 24 pad on all
other layers except planes and masks. The minimum pad size is set
to 30 whenwe go to close the form it states that pad size is too small
for vias and pins and will not close the form. I have done this on
other designs in 15.5.1 oh yeah we are on 15.5.1 S051, so it has
got to be something stupid here.
What have when done wrong is there some other setting or env variable that needs t be turned on to allow this to happen.
Thanks all in advance
Carl,Which form is stating that the pad size is too small upon closing it ?It generates a warning when you attempt to enter a testpoint padstackwhich does not meet the minimum test pad size and leaves the field blankeven before closing the form. So I am unable to recreate what you are seeing.Also I found something a little confusing.. You stated that you are settingthe Allow Under Component to Bottom Layer Only when your testpointsare being added on the Top Layer so this setting should not have any effect.Maybe I misunderstand how the Allow Under Component setting actuallyworks but I always thought that it was to prevent testpoints from being placedunder components on the test side of the board. Can you explain it to me soI am clear on how it works ?Mike CatramboneUTStarcom, Inc.