Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
System Development Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Hi,I'm working on creating an IDF output that will take all place_bounds and export them to an IDF file for better modelling in Pro-E(PTC).I have a board file with an arc which is identified by the following information from the database (in paranthesis the variables used further below)arc center = 1.793,0.133 (a_c)radius 0.058 (r)startEnd((1.85 0.12) (1.78 0.19)) ((x1 y1) (x2 y2))unfortunately the data does not contain the arc angle that was specified inside the package symbol so I'll have to calculate this arc angle in degrees.If I use file, export, IDF and set TYPE=PTC and Version=2.0 then I'll get the following specification/record for this arc0 1.850 0.120 00 1.780 0.190 -244.305which states that the arc angle is -244.305If I however uses the cosinusrelations on the data that I have access to (arc center, radius, arc startpoint and arc endpoint) then I get the following0 1.850000 0.120000 0.000 1.780000 0.190000 -242.83which states that the arc angle is -242.83This makes a difference for about approximately 1.5 degreesI'm using the law of cosines to calculate the anglehttp://en.wikipedia.org/wiki/Law_of_cosines (remember the angle=result*180/pi -360)I'm just wondering how this difference occur. Does anyone have an idea to what I could be doing wrong?
Use the IDF 3.0 format instead.Back when I was a Cadence customer I helped validate the implementation (see algroidf doc)Let me know if this helpsAndyAndreas KulikSr. Applications EngineerPTC
Hi Andy,Thanks for the suggestions, it does however not work properly. Let me explain the actual problem a bit so that you know the reason behind this.IDF output today in Allegro only exports one place bound per component and this is the first place bound found on the component. I'm having quite a of users/companies who requires much better modelling and hence use several place bounds for each component. Often som pins are actually modelled using place bounds with height associated. I know this can be modelled in PRO-E where you will have to create a model for each part. The problem however still exists in core Allegro PCB Editor where customers still would like to get feedback on heights. So basically there is no choice but to write an IDF export program that exports all place bounds. Currently there are a preliminary spec for IDF 4 that does exactly what I want but unfortunately it is not finished and no vendors support it at the momentBest regards,Ole
Good point. There are 2 options to work around this and get the end result1) Model the parts in ProE and use the IDF 3.0 translator from Allegro and a ecad_hint.map file for ProE. The ecad_hint.map file maps the Allegro footprints to the 3D models.I can show you how this works. Let me know if you want to see it and I can setup a webcast.2) The Allegro IDF 3.0 translator should combine muliple placebounds into one single shape inthe IDF library file (.emp). It's been a while since I actually worked with it on this level, but youmight be able to attach a property call HEIGHT to the component instance in Allegro. It shoudl transfer to the IDF library file. If not just use the PACKAGE_HEIGHT_MAX property on one Place_bound (if multiple the highest number will win).When you import this into ProE you will get the shape of the part with the max height. It's not pretty but allows for height interference checks in ProE.I recommend option1. It's the only way in my opinion, if you have tight spaces, where components overlap in the z dimension.AndreasPS: IDF 4.0 contains to much data. Which I think is the reason no ECAD or MCAD vendor is going forward, because to could transfer a design from Mentor to Cadence or back. Same applies for MCAD ;-)Maybe there will be a new different file format that would protect IP but allow meaningfull transfer between MCAD and ECAD.