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We are packaging our chip with a flip-chip package (and c4 flip chip bonds).
We don't have any CLASS BUMP files all we have is CLASS PAD AREAIO for the LVDS drivers and regular drivers.
We have virtuoso layout files for a c4 pad.
We were thinking we would need a bump cell too that would be used in Encounter however.
We are wondering if we are missing a bump cell or is there some way to connect the c4 pad from Virtuoso to Encounter, and how this is done.
If the foundy didn't provide a bump LEF along with the GDS (sometimes they do, sometimes they don't, it's worth asking), it's very easy to create one yourself. This is an example, you'll need to make sure everything matches your particular layout:
VERSION 5.6 ;
BUSBITCHARS "[" ;
DIVIDERCHAR "/" ;
CLASS COVER BUMP ;
FOREIGN bump_70N -47.0 -47.0 ;
ORIGIN 47.0 47.0 ;
SIZE 94.0 BY 94.0 ;
DIRECTION INOUT ;
USE SIGNAL ;
LAYER AP ;
POLYGON -19.47 -47.0 19.47 -47.0 47.0 -19.47 47.0 19.47 19.47 47.0 -19.47 47.0 -47.0 19.47 -47.0 -19.47 ;