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I face problem when I want to move the wire bond in APD16.2. After the first nove of the wire bond, when I want to make second time move, the Bond Fingers will shove togather but the wires stay as it is. It seems like a disconnect between BF and wires. Does anyone know how to solve this ?
How do you implement the bond wires? I use a sub-class under package geometry. It is then not "connected" more than visually. To move a bond wire, I then have to re-draw it.
Which "move" are you using? Edit-->Move, or Wirebond RMB Move (the correct one)?
In reply to BillAcito:
In reply to JacobL:
I think you need to on the wire bond layers. Color>Bond Wire Profiles> check on the profile .
But first, you will need to set up the wire bond profile before do connection.
In reply to Alice:
I have heard of a similar issue before in a few designs. Are your bond wires quite short? What units is your design in? I know it might sound strange, but if they aren't in microns, try changing to microns and doing the move again. This might fix your issue. I know it has on some designs that I have seen.
If you've already moved the wirebonds and they've become disconnected, 16.2 has the Tools -> Package Design Integrity command. Under the wirebond folder, there is a check which will look for bond wires which have become disconnected from their finger (or pin) and will try to reconnect them for you. I would recommend trying that out if you get a second. It's not a solution, but it will usually be able to fix the design up for you so that the wirebond move command works properly again.
In reply to Tyler:
I did as per your recommendation, and it works! How great it is!! Also, is true if wire is long enought I won't see this problem.
I really don't understand why need to have unit as microns to make the Design Intergrity WB checks work. It seems like a major issue for APD 16.2. I need to run Intergrity checks everytime there's disconnect moved WB. I did feedback to Cadence and the feedback is RND will look in to it.
Anyway, really appreaciate your temporary solution as I may proceed with the design.
Thank you very much. =)
I'm glad to hear it works! That's great, Alice!
Also, I'm reasonably sure that the design integrity check bug is scheduled for fix very soon. Last I talked to R&D, the fix was ready, but needed to be built into the next patch for customer release, so we should see it available in the next 2-3 weeks or so.
The disconnect on moving the wirebond is still actively being looked at, so I don't know when that will be ready for release.