Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
System Development Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Hi, does anyone know how to rotate the die or the bga before and after rotation? Currently working on a stacked die package. Would prefer to know how to do it after generation, but for completeness if there is a method to do it before that would be great as well.
I'm not sure what you mean by "before generation", but once placed:
In SiP, the Die Stack Editor tool has a rotation value for each die in the DIE tab.
In APD, you can select the symbol, RMB, and select "Spin".
BillAcito has it right. While some of the die and BGA creation tools, like the BGA/Die text in wizards, allow you to specify the rotation when the component is created, that is not available in all flows. What is available is, after placement, the ability to rotate, move, and mirror the component. You can do this using:
Edit -> Move (allows for rotation as well as movement; available for both APD and SiP users)Edit -> Spin (allows for rotation only; available for both APD and SiP users).Edit -> Diestacks... (allows for rotation, movement, and pad layer change; available only for SiP users).
I believe stacked die packages are only supported in the SiP products, so with luck that is what you are using. If so, the die stack editor tool is the most comprehensive, as it also gives you options for what to do with the bond shell if it exists (stretch the wires to the new pin locations vs. move the wires, fingers, and die as a single unit) and the ability to change the ordering of the dies in the stack by changing the layer that each die is placed on.