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I have a die pad with multiple bonding wires come out from it. Is there a way to create several bonding points on that die pad so the wires
will be seperated instead of coming out from the center. Please help. Thanks.
In APD and SiP, you do not pre-define bonding points on the pads. Rather, you spread the wires per your manufacturing rules using the Route -> Wire Bond -> Tack Point Move command. You can choose to manually move wires a specified distance, move wire ends interactively, or have the tool automatically spread them evenly either parallel or perpendicular to the die edge.
There is, I believe, even a DRC check for wire end to wire end clearance. It's in Constraint Manager, under the Assembly workbook, Wire folder, Wire-to-Wire Online Spacing page. The column name is "Wire End to Wire End".
In reply to Tyler:
Thank you Tyler, I can now move the wire that is there on the die pad, how can I add another wire to the same DP? Thanks again.
In reply to VLSI88:
Never mind the above question I found out how that was done.Thanks again Tyler.