I have designed a schematic on Orcad Capture with active and discrete components. From this design was generated a netlist which was used on PCB editor to develop the circuit layout. Now I need to change packaged IC components by its bare dies. However, I have been facing problems to add the die format inside the design which I already have. The first attempt was to create the die on APD, export a .dra file and include this file as a component footprint on Orcad Capture. After the netlist is generated and imported in the APD or SiP layout, I can't select the die pads to create the wire-bonding and bond fingers.
I also tried to create the die on APD trough text-in wizard and then import the schematic netlist. In this case I can create the wire-bonding and bond fingers, however, the connections between the discrete components and dies are lost.
I'm looking for any help in order to discover the right process to do this development. I couldn't find any Cadence application notes that explain this flow.
I will appreciate any help provided.
Thanks in advance.