Google FeedBurner is phasing out its RSS-to-email subscription service. While we are currently working on the implementation of a new system, you may experience an interruption in your email subscription service.
Please stay tuned for further communications.
Iam new to Package design SIP tool.
I had created the DIE package using SIP. Kindly give the direction how to map the created DIE package in Allegro pcb editor 17.2 ver.
In Allegro design capture CIS tool we had created the schematics file. The DIE which we are using is having 100pins, We had created the DIE in SIP tool. Out of 100 Die pins, only 90 pins is getting connected others are NC pins. We had mapped the Bond fingers only for 90 Die pins in the SIP package. But in the Schematics we had created the DIE logic symbol for 100 pins. Please advice whether we can able to import the DIE package in the allegro tool. In this scenario while importing the 100 pin DIE package in allegro pcb editor will the net connectivity will be shown from the DIE pad to Bond fingers and from Bond fingers to respective components? Please suggest whether we are going in the right path or please advice what we have to proceed with.
Thanks in Advance,