I have created a die and other components as symbols in sip and placed the symbols in sip through logic import capture netlist. It shows net connectivity but i couldn't add bond finger from the die pins. Please help on this.
Check that your die is a legal type for bond wires. It should have an attachment type of "WIRE BOND", and its pads should be on a DIESTACK type layer outside the package substrate layers. Best way to do this is to check for (and add, if needed) the die stack layer through Setup -> Cross-Section first. Then, use Edit -> Die Stack to check and correct the attachment type. If it's flagged as a flip-chip attach component, you can't bond to it. It's not possible to wire bond to a bump.
Once you've seen to the above two likely causes, you should be able to add wire bonds.
Thanks for you guidence. it works.