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are there any commands or scripts that can help to create package stack-up from scratch in an automated manner.
Something that can take in no. of conductor , dielectrics layers along with the thickness and material information and dump a tech file or mcm to be imported into SIP ?
I also wish to parametrize the package dimensions.
you can always import and export the cross section technology file from the cross secton editor.
you can refer to the following youtube to define the cross section.
Thanks for the reply this doesn't have multiple solder_mask addition to the stack up right
on the cross section editor you can place solder as dielectric above "top" conductive layer and another solder as dielectric below the "bottom" conductve layer.
i also define them on the padstack and soldermask_top and soldermask_bottom on the non conductive section of the stackup.
thanks ,is it fine to define mask as a dielectric layer ?
For the package on package each package stack up has a solder mask for itself. So I wish to define solder make separately for them.