are there any commands or scripts that can help to create package stack-up from scratch in an automated manner.
Something that can take in no. of conductor , dielectrics layers along with the thickness and material information and dump a tech file or mcm to be imported into SIP ?
I also wish to parametrize the package dimensions.
you can always import and export the cross section technology file from the cross secton editor.
on the cross section editor you can place solder as dielectric above "top" conductive layer and another solder as dielectric below the "bottom" conductve layer.
i also define them on the padstack and soldermask_top and soldermask_bottom on the non conductive section of the stackup.
thanks ,is it fine to define mask as a dielectric layer ?
For the package on package each package stack up has a solder mask for itself. So I wish to define solder make separately for them.
yes it is fine.
i have designed an interposer on a package as shown below.
Thanks , can you please also advise how can I place balls in the gap area of a POP structure (by GAP area I am referring to the air gap separating the 2 packages) ?
you can simply add one conductor between the 2 solder masks.
you need to make sure that the padstacks connecting the upper and lower packages have the conductor you have just added as well.