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are there any commands or scripts that can help to create package stack-up from scratch in an automated manner.
Something that can take in no. of conductor , dielectrics layers along with the thickness and material information and dump a tech file or mcm to be imported into SIP ?
I also wish to parametrize the package dimensions.
thanks ,is it fine to define mask as a dielectric layer ?
For the package on package each package stack up has a solder mask for itself. So I wish to define solder make separately for them.
yes it is fine.
i have designed an interposer on a package as shown below.
Thanks , can you please also advise how can I place balls in the gap area of a POP structure (by GAP area I am referring to the air gap separating the 2 packages) ?
you can simply add one conductor between the 2 solder masks.
you need to make sure that the padstacks connecting the upper and lower packages have the conductor you have just added as well.
Is it possible to combine 2 sip packages through some utility instead of manual work ?
For example I have a 4 layer OSAT database and I need to add a different interposer database to this original 4 layer database ?
Also can you please share any documents for doing silicon interposer design in SIP/APD ?