are there any commands or scripts that can help to create package stack-up from scratch in an automated manner.
Something that can take in no. of conductor , dielectrics layers along with the thickness and material information and dump a tech file or mcm to be imported into SIP ?
I also wish to parametrize the package dimensions.
you can simply import the different interposer database into the osat database file.
it is only one manual operation.
you need to make sure that the the layer names are the same and the symbol does not have any same name.
if the padstacks have the same name, you need to make sure that all the pad diameters are also identical.
thanks for the reply but BY import do you mean FILE -> IMPORT -> . tcfx file ?
no, it is not tcfx.
i do not have apd in front of me as i work at home today.
but i think, if i am correct, file --> export --> sub-drawing on the different interposer file.
after selecting all the objcts on the all layers, then select the sub-drawing's origin.
then open the osat database file and import the sub-drawing.
thanks I will try this out.
I am also facing an issue that while routing I am unable to add the newly created vias. The via .pad files are in the same folder where the old vias and .sip file lies. But not sure when adding the via seems the option to select any layer is disabled.
try to see that the padstack is correct by tools -> padstack -> modify desgin padstack.
then click the padstack to verify all the pad diameters and layer names are coorect on the padstack.
if this does not work, create a new padstack to see the padstack on the padstack list by tools -> padstack -> modify desgin padstack..