Does anyone have any suggestions on creating footprint with thermal pad that requires topside via tenting on the top side?
I tried making shape symbols for solder mask/ paste mask, but due to the void in the shape it requires I am not able to create it.
I can place the shapes manually in package geo/ SM or PM, but I think lot of the data does not have it to display in the default setting for our filmsetting.
Please let me know if there is a way to make the shape symbols or not.
Thanks in advance.
What is your via pad to SMD pad spacing? Tenting the via will always be cheaper and more reliable than plugging it.
Or, you can set the soldermask opening to the drill size, or slightly larger, allowing them to flush the barrels.