Hi guys, kind of a general question this time. I have a farily dense board with lots of decoupling caps "0603" footprint. I was wondering has anyone used drill in a pad to get to the internal power ground layers without seeding a via. What I was thinking of doing is putting a small 10 mil drill hole in the center to the 0603 pad to connect to the inner layers, kind of make that 0603 pad a th pad.
I dont believe the solder paste will wick through the 10 mil hole to the bottom side of the board, kind of wanted to put the idea out there to see what you think
Puttin vias on pad is what I really like as a designer. It connects the cap directly to the power plane.
Don't put just one via, put 4 small ones.
I remember reading a app note by ultracad(I think), that showed the difference in power integrity.
I think the problem will be with manufacturing. Check if it increases cost.