We sometimes need to define a thruhole via as a stack up of blind microvias and buried vias. This is becasue on th eTop and Bottom layers I need a smaller pad, that cannot be acieved with thruhole via, but only with blind micorvias. Is it possible in PCB Editor to define such a via, or at least to place a via over another in this way?
I'm an experienced self-taught on Orcad Layout 10.5, and I'm in the process to change to PCB Designer 16.6, and I find it very difficult to mentally 'translate' old Layout commands and names to PCB editor, they are so different!
Thanks in advance,
You should download the Allegro HDI Best Practices paper, this can be found at http://support.cadence.com
For stacked vias, start in the Physical domain of Constraint Manager.
Set Pad-Pad Connect for the common layer of the stacked series of vias to
L3, L2 is the common layer.
Once vias are stacked, slide will treat them as a single entity. Use the RMB to split the stack if necessary. The Via label will display the stack in this example as 1-3.