I have been assigned to finish a PCB design with dynamic shapes on both negative and positive artwork layers. The thermal flash symbols are not recognize within the board file when creating a dynamic shape on either positive or negative artwork layers.
When using the padstack editor the thermal definitions are being translated into being a rectangular void of X by X dimensions as if the thermal .ssm file is not accessible.
I know these padstacks are valid as they are being used on a second design with no issues that mates to the design with the problems. I verified that the global shape params are not different between the designs. There are no difference in net properties between the designs.
Its got to be something simple, right?
Might try running flash_convert at a dos prompt. Make a copy of the board first.