https://community.cadence.com/cadence_technology_forums/f/custom-ic-skill/74778/hi-i-want-to-perform-a-call-back-for-each-enterpoint-and-want-to-continue-until-esc-is-pressed-please-help-hereMon, 09 Nov 2026 12:46:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:1658e409-f5bb-4c30-99aa-415d11cdbbd3GB202611098410Hi, I want to perform a call back for each enterPoint and want to continue until ESC is pressed, please help here. Below is the portion of my code looks like. procedure(func_test() let(() until(ESC is pressed pt=enterpoint() proc_callback(pt) );until ); );procedure procedure(proc_callback(pt) body of the main function );proceduerhttps://community.cadence.com/cadence_technology_forums/pcb-design/f/allegro-x-pcb-editor/74776/how-to-export-markup-comments/1435031Mon, 09 Nov 2026 08:08:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:c15b3acf-32d3-47c5-9ddb-857db0d16464B Bruekersapparently the markup data is stored as a Json file in an attachment. att = axlGetAttachment("MARKUP_DB_JSON" 'file) att->data This will give a location of the (temporary) file. This file is a json and includes the view, comments, etc.https://community.cadence.com/cadence_technology_forums/f/digital-implementation/74777/how-does-innovus-calculate-transition-mean-and-sigma-with-ccs-lvf-given-that-liberty-defines-nominal-transition-using-nldm-tablesSun, 08 Nov 2026 16:10:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:7bac5835-901d-4d32-ac8e-fdcc6b03dc17YW202511205917Background I am using Innovus 23.32-s091_1 for post-route timing analysis with detailed parasitics and SI. The standard-cell libraries contain both: CCS driver and receiver models rise_transition / fall_transition Early/late ocv_sigma_*_transition Moments-based ocv_mean_shift_*_transition , ocv_std_dev_*_transition , and ocv_skewness_*_transition The library corner is SS, 0.675 V, 125 °C. The Model types section of reportDelayCalculation identifies both the relevant driver and receiver as CCS . What is confusing me The Liberty 2017.06 manual explicitly defines: PDF page 696, printed page 15-14: The nominal value corresponding to ocv_sigma_rise_transition is specified by rise_transition . The nominal value corresponding to ocv_sigma_fall_transition is specified by fall_transition . PDF pages 710-713, printed pages 15-28-15-31: The moments-based LVF syntax also identifies rise_transition / fall_transition as the nominal transition tables. It defines: Code block mean rise transition = nominal rise transition + ocv_mean_shift_rise_transition with the equivalent relationship for falling transitions. However, with CCS and detailed RC, the tool also computes voltage waveforms at the driver output and receiver inputs. I understand that CCS and LVF can be used together. My question is specifically how the LVF statistics, referenced to the nominal transition tables, are applied to the CCS-based waveform calculation. Questions What nominal transition does Innovus use when applying LVF in CCS mode? The value obtained from rise_transition / fall_transition ? A transition measured from a CCS-generated waveform? Or a transformed/calibrated combination of these? Are the following expressions valid, and under what assumptions? Code block Reported transition mean = slew measured from a CCS waveform + LVF mean_shift Reported transition sigma = the interpolated LVF sigma/std_dev table value I have not found documentation establishing these expressions. In particular, the first expression appears to replace the nominal reference explicitly defined by Liberty. If the CCS waveform-based slew differs from the nominal transition table value, how does Innovus map the LVF mean shift and standard deviation to the actual RC-loaded stage? Are they applied as absolute offsets, normalized/scaled, or processed through another statistical model? What is the statistical meaning of the waveforms reported by reportDelayCalculation -waveform in a SOCV/LVF analysis? Are they nominal waveforms, mean-adjusted waveforms, or something else? Can their threshold-crossing times be compared directly with the reported transition mean? Which reports or settings can expose this calculation? I would like to identify the actual LVF tables and lookup coordinates used, the nominal reference, and any statistical propagation or waveform-related adjustments. Example report For the net arc: Code block INV_X3/ZN → detailed RC network → DFHCQHSXG_X4/D reportDelayCalculation -max -si reports: Code block Transitions Rise Fall Input transition (mean): 0.052500 ns 0.057700 ns (sigma): 0.001845 ns 0.001767 ns Output transition (mean): 0.135100 ns 0.134100 ns (sigma): 0.001845 ns 0.001767 ns This is a net arc : "Input transition" refers to the driver output pin, and "Output transition" refers to the receiver input pin—not the cell's input-to-output arc. Could someone point me to the relevant Cadence documentation or explain the calculation? I am trying to reconcile the Liberty-defined nominal reference with the transition mean and sigma actually reported by Innovus , rather than merely confirm that CCS and LVF can coexist.Digital ImplementaioncharacterizationTiming ClosureInnovus.libhttps://community.cadence.com/cadence_technology_forums/pcb-design/f/pspice/74751/pspice-for-ti-installer-fails-http-403-forbidden-downloading-ti_urls-txt/1435030Sat, 07 Nov 2026 18:39:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:0e838afa-4bf1-48fe-a44e-fbe9f9a09d80RC20261107966I am experiencing the same problem today.https://community.cadence.com/cadence_technology_forums/pcb-design/f/allegro-x-capture-cis/74746/using-capture-cis-25-1-using-orcad-x-professional-plus-and-my-license-is-active-and-cloud-access-is-on-but-i-am-told-i-am-offline-and-when-trying-to-use-parts-from-the-library-i-get-an-error-message/1435029Sat, 07 Nov 2026 16:36:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:67899775-6598-48c8-b30a-f566d3866bd2CP202609102340It is still down on my end as well. Nothing seems to have changed yet.https://community.cadence.com/cadence_technology_forums/pcb-design/f/pspice/74748/pspice-for-ti-installation-fails---http-403-forbidden/1435028Sat, 07 Nov 2026 01:49:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:ee9bfd4a-0144-42dc-bf00-71dfaf12dd9eTA202611061545Hello Cadence Support Team, I am experiencing exactly the same issue when trying to install PSpice for TI. The installer fails with an HTTP 403 Forbidden error when accessing the following URL: https://pcb.cadence.com/startPages/PSpiceTI_data/TI_URLs.txt I downloaded the installer from the official TI website on November 7, 2026. I have also seen several reports of the same issue on this forum. Could you please confirm: Is Cadence currently investigating this issue? Is there an estimated timeline for restoring access to the installation server? Is there an alternative download link or installation procedure available? I would appreciate any updates or guidance on how to proceed. Thank you for your support.https://community.cadence.com/cadence_technology_forums/pcb-design/f/allegro-x-capture-cis/74746/using-capture-cis-25-1-using-orcad-x-professional-plus-and-my-license-is-active-and-cloud-access-is-on-but-i-am-told-i-am-offline-and-when-trying-to-use-parts-from-the-library-i-get-an-error-message/1435027Fri, 06 Nov 2026 21:26:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:bc417fd6-ae22-4870-8f6a-1a8b998ed0d2TG202408061233I can't access the cloud either and it was supposed to be fixed by now. Seems like this would effect a lot of people and very strange that its been down for so long.https://community.cadence.com/cadence_technology_forums/pcb-design/f/allegro-x-pcb-editor/74776/how-to-export-markup-comments/1435026Fri, 06 Nov 2026 20:24:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:97cfe8de-17c2-48d4-a1bf-17e80082cacaJuanCRHi. The only way to export markup comments is to Archive them. However, this will also delete them from the database and will make them inaccessible from the database.https://community.cadence.com/cadence_technology_forums/pcb-design/f/allegro-x-pcb-editor/74776/how-to-export-markup-commentsFri, 06 Nov 2026 15:55:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:e5e58724-640b-434e-ab6c-8b4ee91117a1BC202603263145Hi Folks, I have several markup comments in my design. Is there a way to export all the markup comments to a PDF or text file? Can this be automated using SKILL?https://community.cadence.com/cadence_technology_forums/pcb-design/f/allegro-x-apd/74775/quick-tip-streamlining-continuity-test-routing-with-the-daisy-chain-generator-in-allegro-x-advanced-package-designer-apdFri, 06 Nov 2026 15:46:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:b152f112-c0fd-4d5c-9c17-f8a32c3b1dd4Gowtham PCreating daisy-chain structures manually for package test vehicles and reliability testing can be time-consuming. The Daisy Chain Generator in Allegro X APD simplifies this by helping create and validate daisy-chain connectivity between the package and die or board , making it easier to check connections and isolate potential failures. Why is it useful? Multiple path options: Horizontal S, Vertical S, Angle S, Coil, Custom, Scribble, Snake, and imported geometry such as DXF/GDS. Flexible connectivity: Configure different numbers of pins on the substrate and complementary die/board sides. Routing automation: Create clines and optionally add vias/structures for internal-layer routing. Test-point support: Add and customize test points to provide access to individual chain segments and help isolate open connections. Connectivity verification: Export substrate and complementary-side netlists and display complementary links for visual verification. How to Get Started Go to Route > Daisy Chain Generator in Allegro X APD Select the pins and choose a path pattern such as Horizontal S, Coil, Scribble, or Snake . Configure the substrate and complementary-side connections. Define routing, vias/structures, net names, and test points as needed. Generate the chain and visually verify the connectivity. Have you used the Daisy Chain Generator in your package designs? What has your experience been?daisy chain generatorAPDhttps://community.cadence.com/cadence_technology_forums/pcb-design/f/allegro-x-capture-cis/74746/using-capture-cis-25-1-using-orcad-x-professional-plus-and-my-license-is-active-and-cloud-access-is-on-but-i-am-told-i-am-offline-and-when-trying-to-use-parts-from-the-library-i-get-an-error-message/1435025Fri, 06 Nov 2026 09:21:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:d447cfd0-0622-4c69-9fe8-965a99dea8b5maxx1234Has it been fixed yet ? I am still having the same issue.https://community.cadence.com/cadence_technology_forums/pcb-design/f/pspice/74748/pspice-for-ti-installation-fails---http-403-forbidden/1435024Fri, 06 Nov 2026 07:26:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:173e733e-1a87-49c7-aa29-5dbc93b3de7eZD202611052735I have exactly the same issue. Can you please support !https://community.cadence.com/cadence_technology_forums/pcb-design/f/allegro-x-capture-cis/59144/pack_short-property-on-heterogeneous-symbol-causes-error/1435023Fri, 06 Nov 2026 07:18:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:e59ed093-f959-41f2-9b57-73496de45feftzsoltIn the olb library if I delete from the other sections only the value of the PACK_SHORT property then the value disappear from the original section too!https://community.cadence.com/cadence_technology_forums/f/awr-design-environment/74740/awr-executable-is-being-blocked-by-windows-before-it-launches-how-can-i-fix-it/1435021Thu, 05 Nov 2026 23:36:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:3767afc8-06dd-4e17-a6b8-300068df5cd5MR202610193757How to Run the Cadence AWR Installer if Windows Blocks It Search for Command Prompt in the Windows Start menu. Right-click Command Prompt and select Run as administrator . Click Yes when prompted by User Account Control. In Command Prompt, enter the full file path to the AWR installer, enclosed in double quotation marks ( " " ). Press Enter to launch the installer. Example: "C:\Users\name\OneDrive\Desktop\Hotfix_AWR25.10.080_wint_1of1.exe" Note: Replace the example path with the actual location of your downloaded installer. You can find the path by holding Shift , right-clicking the installer, and selecting Copy as path . Hope this works for you!https://community.cadence.com/cadence_technology_forums/pcb-design/f/allegro-x-pcb-editor/74767/looking-for-a-transition-zone-for-rigid-flex/1435020Thu, 05 Nov 2026 18:16:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:d07d8fed-76ec-46c3-8d1d-0d1b8b38edf2Mhawley1hello , thank you for this . We can give a try at skill code , , I guess sampling the vector of the Clines and seeing that they are normal to the some unique class line at the boundary . Ill talk with the group at the company and if we device some solution ill post it here.https://community.cadence.com/cadence_technology_forums/pcb-design/f/allegro-x-pcb-editor/74767/looking-for-a-transition-zone-for-rigid-flex/1435019Thu, 05 Nov 2026 15:28:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:b155bf11-856d-4937-8202-71406337c160JuanCRHi Mhawley1 . I've looked into our database and it doesn't seem like there's a DRC that would check this. If enforcing perpendicular trace routing across zone/bend boundaries is required for manufacturing or rigid-flex design guidelines, this can be achieved using Allegro Relational Rule Developer (Ravel) or custom SKILL scripts.https://community.cadence.com/cadence_blogs_8/b/cadence-support/posts/welcome-ulkasemi-vlsi-training-institute-to-the-cadence-cctp-programThu, 05 Nov 2026 07:32:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:c99871da-247d-4507-b683-15b1107d9278prabhabThe semiconductor industry requires a highly skilled workforce and necessitates recent engineering graduates to swiftly bridge the gap between academia and practical application. This is where the Cadence Training Partner Certification Program comes in. This program provides a learning environment that helps students successfully transition from academia to industry. To qualify for Cadence's certification, partners must have a proven track record of educating and placing students, along with a portfolio of high-quality courses. Ulkasemi VLSI Training Institute (UVTI), based in Dhaka, Bangladesh, is renowned for its top-tier training solutions. It is Bangladesh's first large-scale training center dedicated to chip design and Very Large-Scale Integration (VLSI) workforce development. We recently welcomed them as a Cadence Certified Training Partner, specializing in synthesis and Static Timing Analysis, digital physical design, analog physical design, and verification. Scott Hargraves, Group Director of Customer Education at Cadence, stated, "We are excited to welcome UVTI as a Cadence-certified training partner. Their expertise in electronic design and commitment to integrating Cadence’s cutting-edge software and methodologies into their curriculum will greatly benefit students and the industry as a whole." Mohammed Enayetur Rahman, Managing Director at Ulkasemi VLSI Training Institute (UVTI), said, “ We are delighted to become a partner in the Cadence Training Partner Certification Program, marking a significant milestone in our commitment to advanced semiconductor education. With our trainers completing Cadence courses and earning badges, and our curriculum aligned with Cadence course content, we are committed to delivering structured, industry-relevant training. Through this partnership, we aim to equip aspiring engineers with the practical knowledge and skills needed to excel in semiconductor design.” The UVTI team The Cadence Training Partner program awards badges in key technology areas, recognizing students’ achievements and validating job-ready skills they can showcase on social media. By developing talent in the latest tools and methodologies, the program can accelerate product development, shorten time to market, and improve design quality. Through this program, Cadence and UVTI are building a collaborative community of Industry-ready engineers equipped to advance skill and innovation. Welcome, UVTI, to the Cadence Certified Training Partner Program!digital badgeblended trainingCustomer TrainingtutorialtrainingCadence trainingdigital badgeslearninggapCadence certifiedbridgingthelearninggapCadence Education Serviceslearning and supportTraining Partnershttps://community.cadence.com/cadence_blogs_8/b/artificial-intelligence/posts/meet-cadence-s-chipstack-ai-super-agentThu, 05 Nov 2026 07:20:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:61957036-2843-4edc-ac4b-071bf8d0a331Vinod KheraCadence ChipStack AI Super Agent shifts AI in EDA from helping with individual tasks to coordinating a connected, evidence-driven design-and-verification workflow, with engineers remaining accountable for the final engineering decision. Every stage of front-end design and verification produces information that the next stage depends on: specifications shape RTL, RTL informs verification plans and testbenches, and simulation, formal analysis, coverage, and debug results determine what happens next. Yet much of this workflow still depends on how well context travels across tools and activities, how quickly the latest evidence is interpreted, and how the next step is coordinated. Traditional optimization AI can speed up individual tasks, but faster tasks alone do not create a connected engineering workflow. The larger opportunity is to preserve design intent across activities and let the outcome of one operation guide the next. The Cadence ChipStack AI Super Agent is built for that opportunity. It applies agentic orchestration to front-end design and verification, using a shared mental model of the design and multiple specialized AI agents that work across Cadence EDA technologies. Around a single engineering objective, it orchestrates RTL generation, verification planning, tool execution, analysis, debug, and iteration, while engineers inspect the generated artifacts and tool results and guide the work as needed. Where Engineering Time Goes Between Design and Verification Every new generation of silicon brings greater design complexity and increases the effort required to verify that it functions as intended. Although EDA tools automate many individual tasks, engineers still spend considerable time connecting those tasks and deciding what to do next. Traditional EDA automation is effective when the task and its execution path are already defined: run a regression, execute a formal proof, analyze coverage, generate a report, or investigate a failure. The challenge often lies between these tasks. Engineers must interpret results, correlate findings across tools, determine whether an issue originates in the RTL, testbench, or verification assumptions, and decide which analysis or action will move the process forward. This coordination is further complicated by the breadth of capabilities available in modern EDA tools. Identifying the right combination of analyses and applying them in the right sequence can require substantial expertise and effort, particularly as design complexity grows. The ChipStack AI Super Agent is designed to address this coordination challenge by connecting design and verification activities through a shared understanding of design intent and verification context. Rather than treating each task in isolation, it coordinates relevant workflows, uses intermediate results to guide subsequent actions, and helps engineers move from an initial objective toward evidence-backed results. Engineers remain responsible for evaluating the findings, making engineering decisions, and approving the outcome. Giving the Agent the Same Design Understanding You Have An experienced engineer does not read the first sentence of a specification and start coding. They absorb the whole specification, form an understanding of the design intent, and only then write the design or the testbench. The ChipStack AI Super Agent follows the same principle through its mental model. The agent builds a design-specific mental model from the engineering inputs available to the workflow, which can include specifications, user prompts, existing RTL, testbenches, block diagrams, and behavioral models. It organizes that information into a structured representation of the design intent, hierarchy, functionality, and relationships. When only a specification is available, the agent builds its understanding from that source. When RTL and testbenches also exist, Cadence technologies ground the model in the implemented design. For example, Jasper can read the RTL to understand its connectivity, and Xcelium can parse the design and testbench to understand the existing verification capability. Because the mental model captures both the stated intent and the implementation, it can expose problems before any simulation runs. If the specification states that an output port should be driven to a specific value on reset but the RTL does not do so, comparing the two directly reveals the inconsistency. That shared understanding is then reused across verification planning, formal-environment creation, UVM testbench development, and analysis of verification results, so no activity has to interpret the design independently. Combined with specialized Cadence skills and deep integration with Cadence EDA technologies, the mental model gives the agent tool capabilities and engineering context that a general-purpose coding agent does not inherently possess. One Objective, End to End Consider an engineer who gives the ChipStack AI Super Agent a single request: "Help me verify this new RTL meets my specification, fix minor errors, and return coverage metrics." The inputs are the RTL and the specification. Here is how that request moves through the workflow: Understand. The mental model agent elaborates the design (hierarchy, connectivity, parameters), enriches it (functionality, interfaces, protocols), and reasons over it to capture design intent. Review and refine. The engineer can review the mental model and the resulting test plan, and refine each through conversation with the agent before execution. Many customers currently get the most value from this iterative way of working. Plan and build the environments. For formal analysis, this includes a formal test plan, assertions, assumptions, and run scripts. For simulation, it includes a feature-based test plan with coverage goals, and the UVM sequences, monitors, and coverage needed to run it. Execute. A unit-test agent simulates chip behavior using Xcelium Logic Simulation, and a formal agent verifies design compliance using Jasper Formal Verification. Return evidence. Execution produces bug reports and log files. Fix. The RTL agent rewrites the code to address the issues found. Report. The super agent orchestrates the loop and returns the updated RTL with coverage metrics: proof core, cone-of-influence (COI) coverage, functional coverage, and code coverage. Decide. The engineer reviews the RTL, the coverage, and any unresolved issues, and retains final signoff. Throughout the loop, a proposed fix is an engineering artifact, not evidence of correctness. The relevant Cadence solution analyzes each change, and the resulting formal, simulation, coverage, and debug evidence must be reviewed. The same pattern applies at the regression level. An engineer can ask the agent to review an entire regression, cluster the issues, and fix them. The agent uses Verisium Manager to cluster failures and rank them by error signature, uses Verisium Debug to trace drivers and analyze the root cause, and then proposes fixes, applies them to the UVM testbench, and iterates. In short, the workflow runs: Engineering Objective → Mental Model → Agent Reasoning → EDA Tool Orchestration → Analysis and Feedback → Iteration → Verified Outcome . In one example, Cadence reports that agents running hundreds of dynamic simulations with Xcelium Logic Simulation and Jasper Formal Verification delivered RTL validation cycles that were over 40X faster , cutting a typical five-week verification loop to less than a day. That result applies to a specific portion of the verification of one IP block, not to end-to-end chip design. Where You Stay in Control Cadence has announced Level-5 autonomy for the ChipStack AI Super Agent. Rather than relying on step-by-step prompts, the agent evaluates intermediate results, determines next actions, and iterates toward closure across tasks such as specification understanding, RTL generation, verification planning, formal analysis, simulation, debug, and design convergence. Engineers inspect, guide, and collaborate as needed, shifting from executing individual tasks to supervising outcomes and guiding intent, and they retain final signoff. Native integration with collaboration environments and compatibility with tools like Codex or Claude Code provide transparency into autonomous activity, helping teams stay connected to the system’s progress and decisions. Teams can choose a fully autonomous flow or the iterative approach described above. Because engineering flows vary significantly across organizations, the ChipStack AI Super Agent also supports customer-defined skills and adaptations to existing methodologies, wrappers, and tool environments. Teams can incorporate their own engineering practices without reducing the agent to a general-purpose coding interface. What Cadence Reports Cadence reports up to 10X productivity improvements across coding designs and testbenches, creating test plans, orchestrating regression testing, debugging, and automatically fixing issues. The over-40X RTL validation speedup described earlier applies only to the specific verification loop in that example. In the next article, we examine where productivity is lost during EDA tool execution and how coordinated, evidence-driven workflows can help teams move more efficiently from a specification change or failure to verification confidence. Frequently Asked Questions About the Cadence ChipStack AI Super Agent What is the Cadence ChipStack AI Super Agent? The Cadence ChipStack AI Super Agent is an agentic AI solution for front-end SoC design and verification. It uses a shared mental model and specialized AI agents to coordinate activities such as RTL generation, verification planning, testbench development, regression orchestration, and debug across Cadence EDA technologies. What changes in an engineer's day-to-day workflow? Instead of manually initiating and coordinating every activity, engineers can define an objective, such as verifying RTL against its specification. The ChipStack AI Super Agent uses the available design context to coordinate the relevant activities, run the tools, analyze results, and determine subsequent actions. Engineers can review and refine the workflow and examine the resulting artifacts and evidence What does Level-5 autonomy mean for the ChipStack AI Super Agent? Level-5 autonomy enables the ChipStack AI Super Agent to independently execute complex chip design and verification workflows, evaluate intermediate results, determine subsequent actions, and iterate toward the defined objective. Engineers can inspect and guide its activities as needed, while retaining responsibility for engineering decisions, final acceptance, and signoff. Does the ChipStack AI Super Agent replace Xcelium, Jasper, or other Cadence tools? No. It orchestrates trusted Cadence technologies, such as Xcelium Logic Simulation, Jasper Formal Verification, Verisium Manager, and Verisium Debug, around a defined objective. Simulation, formal analysis, coverage, and debug results remain the evidence used to evaluate the work. Does the ChipStack AI Super Agent support cloud-based and on-premises models? Yes, ChipStack AI Super Agent flexibly supports cloud-based and on-premises frontier models, including open and cloud-hosted models, to improve designer productivity. This continues the fulfillment of the vision of a true “silicon agent,” spanning the many disciplines and workflows needed to deliver the next generation of intelligent devices. Who owns the mental model? The mental model is customer-specific, resides on the customer's premises, and can be reused across sessions. It is not stored or owned by Cadence. Customers should refer to the approved product documentation for the applicable data-handling and deployment details. Explore the Cadence ChipStack AI Super Agenthttps://community.cadence.com/cadence_technology_forums/orcadx/f/login-licensing-installation/74769/orcad-x-26-1-academic-license-intermittent-lmc-07702-validation-error/1435018Thu, 05 Nov 2026 07:18:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:1fce449e-e820-41d5-94ec-afaa790cb896GL20261101989Update – November 5, 2026: Reproducible Licensing Failure and Capture Crash Hello Cadence Community, I would like to provide an update regarding the intermittent licensing issue on my university laboratory desktop. Software and license: OrCAD X Capture CIS 26.1 P001 (Build 4490145) OrCAD X Professional Plus Single-User Academic License (POX300) License entitlement expires on May 1, 2027 New observations: OrCAD X Capture launches successfully and can remain on the Start Page for approximately 10 minutes without any licensing warnings. When I open my existing LLC converter project ( llc_test.opj ), the following warning appears immediately: WARNING(LMC-07702): Unable to validate the licenses ... (103) Internal error condition (1993) To determine whether the issue was related to my original project, I created a completely new test project named error_test.opj . During the process of opening the new schematic, Capture unexpectedly crashed. The generated crash report contains the following information: Exception: ACCESS_VIOLATION Faulting module: orDb_Dll64.dll Function: DboPage::GetOwner Application: Capture 26.1 P001 Crash timestamp: November 5, 2026, 15:02:15 (UTC+8) Previous troubleshooting: Updated the license using the Cadence installer. Restarted Windows. Tested both the university Ethernet connection and a separate mobile internet connection. Checked Windows Defender Firewall permissions for Cadence applications. The license temporarily worked after updating, but the issue returned. The same academic license was successfully used on my personal laptop on November 4, including PSpice simulations. I have also previously encountered LMC-021993 when launching PSpice. At this point, I cannot determine whether the licensing errors and the Capture access violation share the same underlying cause. Could a Cadence engineer please advise: What does internal error condition (1993) indicate in the Single-User License validation process? Could switching the active academic Single-User License between two computers cause this behavior? Are there any specific licensing diagnostic logs or troubleshooting procedures recommended for OrCAD X 26.1? Could this issue be related to a known defect in Capture 26.1 P001? I have retained the Capture crash report and memory dump and can provide them through an appropriate private support channel if needed. Thank you for your assistance.https://community.cadence.com/cadence_technology_forums/system-analysis/f/clarity-3d-solver/74773/how-is-temperature-dependent-conductivity-handled-in-clarity-3d-when-using-encrypted-ircx-ircx-or-tech-tech-files-during-gds-to-spd-translationThu, 05 Nov 2026 01:26:00 GMT75bcbcf9-38a3-4e2e-b84b-26c8c46a9500:5826e6bd-cafd-4b86-8265-f0b3c0417f1dALLpdfClarity 3D does not use the iRCX/Tech or GDS files during simulation run time to compute temperature‑dependent material properties. These files are referenced only during the translation stage (to generate the SPD file). To observe temperature‑dependent effects in simulation results when using an * encrypted .ircx/tech file , follow the steps below: Open GDS to SPD Translator . Browse and upload the GDS file. In the Map File section, specify a map file. You can provide a .map , .layermap , or .ircx file. Browse and upload the corresponding technology (.tech) file. Go to Settings to open the GDS to SPD Settings window. Navigate to the Options tab, enable the " Create temperature dependent metal " option, and then click OK . Run the translation and perform the simulation using the generated SPD file . After enabling this option, you will observe that the simulation results now vary with temperature .