Sorry in advance if this is a simple question easily answered elsewhere.
I am creating a PCB that needs to have different sized layers. Basically the stackup is as follows:
routing/signal layers (dielectrics and conductors)
The die has a footprint, but the LTCC and the interposer are significantly smaller in size than the circuit board on the bottom. Is there a way to model this in Allegro? Thanks for any help. Obviously this is a simple description of the project.