Ha any used IPC7351 Spec for lead free footprints yet? In determining
BGA footprint they talk about a collapsing and non collapsing ball. If
its collapsing the pad size is reduced if it is non collapsing then the
pad size is increased. I have never seen this information on the part
data sheets? How does one know? I got this data point
off a search but have never seen a BGA specked with a nominal ball of .15 .17 MM
How is everyone else dealing with this?
BOttom line to me is do I really need another footprint for a leaded vs. a non lead BGA
Ahead of time for all answers.
There is also this post.http://www.pcblibraries.com/forum/forum_posts.asp?TID=1121Has some information to clarify things in the PDF's in the post.Mike