Silvus Achieves Faster Tapeout of Advanced RF-MS Chip with Cadence Managed Cloud

Silvus Technologies announced the successful tapeout and bring-up of an advanced RF-mixed-signal chip leveraging Cadence tools in the managed cloud environment. This powerful IC boasts an impressive 15 million devices and enables cutting-edge signal processing using analog circuits.

“We are thrilled to collaborate with our valued partner Cadence to achieve this major accomplishment of a successful tapeout of our chip where all the tested units have met the target spec goals, and 95% of the tested units are meeting extended spec goals,” said Pankaj Goyal, director of IC engineering, at Silvus. “The Cadence Managed Cloud environment enabled us to work at a rapid pace to over-achieve our targets. Special thanks to the Cadence support team that helped us throughout the process.”

Silvus Technologies is the world’s leading developer of advanced mimo communication systems for tactical applications. They develop the world’s most powerful and portable tactical mimo radios that deliver the throughput, range and reliability demanded by military, law enforcement and broadcast teams who can’t risk communication failure. Silvus Technologies products, including StreamCaster radios, have been deployed for a variety of challenging applications around the world.

Silvus Technologies leveraged Cadence front-end to back-end tools to design and tape out the advanced RF-mixed-signal chip in the cloud with an aggressive schedule, adding to 100s of tapeouts that Cadence’s customers have already done in the cloud. Silvus used all Cadence tools in their design and ran both AMS and DMS verifications. The chip is an analog-top flow, designed using Cadence’s Spectre Simulation Platform as the analog solver. The Cadence Design Services team worked very closely with the Silvus engineering team with the flow setup and other debugging tasks. The Cadence Managed Cloud environment enabled both teams to collaborate very effectively, resulting in a rapid tapeout. This successful chip design and tapeout in the cloud is a great example of how a turnkey, EDA-optimized, cost-efficient, scalable and secure environment can be leveraged to collaboratively design the most complex chips.

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