Cadence Blogs

Read this blog for getting an overview of post-layout circuit simulation & GDSII generation.

Unstructured meshing can automate much of the mesh generation process, saving significant engineering time and cost. However, controlling numerical errors resulting from the discrete mesh requires adaptation to the developing solution. Join this webinar to learn how Cadence CFD Adaptive Grid Generation methods use a continuous-size field that gets updated as the solution progresses. As a result, adherence to the underlying…

The world around us has become data-centric; everything needs data, from navigation maps in vehicles to medical chatbots to autonomous cars. We are using data to solve complex problems and decision-making. The beauty is more data leads to better per...

Learn how the Voltus-Sigrity X integrated solution can help you achieve faster system-level power integrity analysis and closure.

A core part of what we do at Cadence comes from an inescapable truth: designing and fabricating a silicon chip is an increasingly complex, time-consuming, and therefore expensive process. At every step of that process there are decisions to be made....

The Team RF "μWaveRiders" ブログシリーズはCadence AWR RF製品のためのショーケースです。月ごとの話題は、Cadence AWR Design Environmentのリリースのハイライト、機能ビデオとスポットライト、ソフトウェアのヒント、コツ、カスタマイズによって異なります。 最新のμWaveRidersのブログ投稿についてのメール通知を受け取りたい方はSubscribe をして下さい。 AWR Design Env...

High-end SOC architectures today requiring more area and higher speed to transfer and process data. To fulfill this requirement, protocol such as PCIe, USB, DP, SATA and USB4 are regularly being updated. Most critical part of the high-speed interface is the Physical (PHY) layer of the protocol where the actual signaling happens. In addition to signaling, the PHY also takes care of some of the processing to reduce errors…

AWR V22.1 software introduces the Pointer-Hybrid optimization method which uses a combination of optimization methods, switching back and forth between methods to efficiently find the lowest optimization error function cost. The optimization algorithm automatically determines when to switch to a different optimization method, making this a superior method over manual selection of algorithms. This method is particularly…

https://youtu.be/gLQbSlICCaE Made in Munich Englischergarten (camera Carey) Monday: Tensilica for Automotive Radar Tuesday: Passage: Wafer-Scale Programmable Photonic Communication Wednesday: Software 2.0 Thursday: Offtopic: Old Programming Languages...

The Allegro Package Designer Plus course provides all the essential training required to start working with Allegro® Package Designer Plus. The course covers all the design tasks, including importing IC data, BGA generation and connectivity gener...

The automotive world is conquering new technological heights, piggybacking on advanced semiconductor components. A typical vehicle has around 1,400 semiconductor components, and the numbers are expected to go higher as vehicles become more intelligent and autonomous. The ecosystem change in the automotive world has mutated the demand patterns for automotive chips, resulting in the growing demand for purpose-driven applications…

Motorcyclists riding through extreme conditions need a communication device that’s as rugged as the road ahead of them. That’s where Cardo Systems comes in, with their tough, dependable, and durable communicators. Most of all, their commu...

This is the last day before a break. Tomorrow I fly to Germany for CadenceLIVE Europe, and I will be taking a week of vacation after that to visit Berlin, a city I've somehow never visited. Breakfast Bytes will next appear on November 30th. As us...

I recently came across the idea of "software 2.0". I was watching a Lex Fridman interview with Andrej Karpathy called Andrej Karpathy: Tesla AI, Self-Driving, Optimus, Aliens, and AGI | Lex Fridman Podcast #333. I'll embed the podcast a...

Hyperscale compute, using high-performance connected processors, continually transforms our lives as more and more applications rely on this type of compute, and at the heart of this hyperscale revolution are data centers. It is estimated that an eq...

One of the most intriguing chips presented at HOT CHIPS earlier this summer was Lightmatter's Passage. I covered it briefly in my summary post about the conference HOT CHIPS Day 1: Hot Chiplets. Steve Klinger, Lightmatter's VP of product, presented a...

Companies across all industries are beginning to harness the power of simulation to develop new products, enhance customer experience, and unlock operational efficiencies. Digital twins, connected models and simulations of industrial assets, process...

Since 2018, Cadence has partnered with Team4Tech to make a mark on the world by connecting employees' business knowledge and tech skills with select non-profit partners in underserved communities. This program has been an incredible way for ...

Merry Monday, and welcome to another look back at what we've been up to at Fidelity CFD over the past two weeks. From the Blogs Cadence Welcomes Cascade Technologies Cadence welcomes Cascade Technologies, an innovator in the field of computation...

At the recent Linley Fall Processor Conference, Cadence's David Bell presented Tailored Automotive Radar Processing with Tensilica ConnX DSPs. There are four primary types of sensors that can be used in automotive applications: cameras, lidar, r...

To successfully develop and maintain designs, you need some way to track changes to a schematic and layout to determine which version of a logic design was loaded into your PCB. In an Allegro® Pulse-managed environment, you can easily s...

The University of Michigan Electric Boat (UM-EB) is a student team that’s designing the next generation of the naval industry. They’re designing, building, and racing electric boats to compete on a national stage, and they’ve commit...

The DATE conference, the biggest EDA conference in Europe will be held April 17-19 2023, in Antwerp, Belgium. After three years of a virtual conference, the European and international EDA and microelectronic design communities will finally get t...

At the recent Linley Fall Processor Conference, the first day wrapped up with a presentation by Ivor Barber of AMD, where he is the Corporate VP of Packaging. He started with an introduction to chiplets which I will skip. In fact, I think he ran thro...

There are multiple instances when FEA tools are compared with CFD. Although both tools can solve thermal problems, there is a difference in the solution accuracy while solving different physics.