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Featured

Corporate News

Accelerate Chip Design with Arm Architecture: Cadence EDA Tools on AWS Graviton

Cadence has qualified its full EDA flow on Arm-based AWS Graviton CPUs, and Annapurna…

Corporate
Corporate 8 Sep 2026 • 4 min read
news story , Cadence Oncloud , featured , AI-Driven Design , aws

Corporate News

Advanced AI Scaling with 3D-IC and Heterogeneous Integration

As AI and high‑performance computing (HPC) designs advance at leading-edge nodes…

Corporate
Corporate 1 Sep 2026 • 5 min read
Hetrogenenous , featured , 3DIC , TSMC , TSMC Certified design flows

Academic Network

10-2: IEEE Microwave Theory and Technology Society at Texas A&M University

Written by Denisse Alvarez, Sai Gudavalli, Mathew Klein, Zaafir Siddique, Roman Venegas…

Kira Jones
Kira Jones 23 Aug 2026 • 3 min read
Microwave theory , featured , Cadence Academic Network , AWR software

Corporate News

Honda + Cadence = Physical AI (part 3): Creating a Chip the World Has Never Seen

Hello everyone. I'm Kentaro Komori, an engineer in the Semiconductor Research at…

Corporate
Corporate 19 Aug 2026 • 9 min read
featured , physical ai , HGR , AI , Honda
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  • All 6535
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  • Learning and Support 65
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  • SoC and IP 440
  • System, PCB, & Package Design  1024
  • Verification 1340
  • Cadence Japan 22
  • Physical Systems Simulation 41

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  • PCB、IC封装:设计与仿真分析 143
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Blog - Post List
Latest blogs

Corporate News

Accelerating AI Silicon Design with AI-Driven Flows

AI silicon complexity is rising faster than engineering teams can scale with traditional…

Corporate 9 Sep 2026 • 4 min read

PCB、IC封装:设计与仿真分析

先进封装热翘曲仿真:温度依赖材料模型如何提高预测精度?

随着芯粒、2.5D 封装、3D IC、AI 服务器以及高性能计算(HPC) 等先进封装技术快速发展,热翘曲已经成为影响产品可靠性、 组装良率和长期性能的重要因素…

SDA China 8 Sep 2026 • less than a min read
Chinese blog , 热翘曲仿真 , 温度依赖材料模型 , 2.5D封装热分析 , 中文 , 热膨胀系数 , 先进封装热分析 , 封装可靠性分析

Corporate News

Accelerate Chip Design with Arm Architecture: Cadence EDA Tools on AWS Graviton

Cadence has qualified its full EDA flow on Arm-based AWS Graviton CPUs, and Annapurna…

Corporate 8 Sep 2026 • 4 min read
news story , Cadence Oncloud , featured , AI-Driven Design , aws , ARM

PCB、IC封装:设计与仿真分析

PCB 设计数据越来越复杂,工程团队为什么还在用传统文件管理方式?

随着 PCB 设计规模持续扩大,企业正在产生前所未有数量的设计数据。从原理图、PCB数据库、元件库、BOM,到制造文件、仿真模型、机械协同数据,工程团队每天都在与海量设计信息打交道…

SDA China 7 Sep 2026 • less than a min read
工程协同 , PCB设计流程优化 , PCB Data Management , 设计数据自动化 , PCB设计数据管理

PCB、IC封装:设计与仿真分析

为什么只做 SI 或 PI 仿真,已经不足以支撑高速设计签核?

随着 SerDes、DDR5、224Gbps 高速链路等技术快速发展,PCB 设计中的信号完整性(SI)与电源完整性(PI)之间的关系越来越紧密。然而,许多工程师的分析流程仍停留在…

SDA China 6 Sep 2026 • less than a min read
Chinese blog , ddr5 , PDN , Sigrity X , 高速设计 , DRC , 中文 , 兼顾电源影响的SI , SSN分析 , SI分析与建模

System, PCB, & Package Design 

Using In-Design Analysis to Cut PCB Design Cycles in Half

To succeed in today’s highly competitive electronics markets, designers are moving…

MSATeam 3 Sep 2026 • 3 min read
Sigrity Aurora , Sigrity X , Allegro X PCB Editor , in-design analysis , Allegro X Design Platform , Clarity 3D Solver

Artificial Intelligence (AI)

AI-Driven Simulation for Faster and Confident Thermal Design

This blog is based on the presentation delivered by Jiwon Yu from Celestica titled…

Veena Parthan 2 Sep 2026 • 5 min read
CFD , Celestica , Optimality Intelligent System Explorer , Celsius EC Solver , AI-driven simulation , Electronics cooling , AI for design

SoC and IP

What Is Physical AI? Why It Demands a New Class of Silicon

Artificial intelligence is moving out of just the data center and into the physical…

Max zarco 2 Sep 2026 • 9 min read
IP , physical ai , chiplet , Silicon Solution Services , Neo IP , secure ic

Verification

Flexible UALink Verification for Any Layer, Interface, and Design Configuration

Modern AI training and inference clusters rely on hundreds or even thousands of GPUs…

SG202607104355 2 Sep 2026 • 3 min read
Verification IP , Functional Verification , VIP , UALink

Cadence Japan

レイテンシとスループットを理解する

※本ページは、2022年に公開された Cadence Blog「 Understanding Latency versus Throughput 」をもとに、AI翻訳ツールを活用して日本語化したものです…

Cadence Japan 2 Sep 2026 • less than a min read
throughput , latency , japanese blog , HLS

Academic Network

Nine Years of Empowering the Next Generation of Chip Innovators

For nine consecutive years, Cadence has proudly supported the China Postgraduate…

Tracy Zhu 1 Sep 2026 • 1 min read
Cadence Academic Network , AgenticAI , EDA , AI-Driven EDA

Corporate News

Advanced AI Scaling with 3D-IC and Heterogeneous Integration

As AI and high‑performance computing (HPC) designs advance at leading-edge nodes…

Corporate 1 Sep 2026 • 5 min read
Hetrogenenous , featured , 3DIC , TSMC , TSMC Certified design flows , HPC , AI , TSMC-COUPE

Physical Systems Simulation (CAE)

How Many Design Experiments Does a Machine Learning Predictor Actually Need?

Machine learning prediction in CAE has a clear proposition: Train a predictor on…

AnneMarie CFD 1 Sep 2026 • 6 min read

Analog/Custom Design

From “Where Do I Click?” to Confident Virtuoso IC Layout Designer

What if the moment you opened Virtuoso no longer felt overwhelming-but empowering…

VEENA G P 31 Aug 2026 • 4 min read
IC25.1 , Cadence blogs , Layout EXL , digital badges , Layout , Virtuoso , Virtuoso Layout Suite , Custom IC

SoC and IP

DDR5 MRDIMM Gen2: The Missing Link in Scaling AI Infrastructure

AI systems continue to grow exponentially in size and complexity. Today, most attention…

Kos Gitchev 31 Aug 2026 • 2 min read

Digital Design

What Should I Do If AI Is Doing Everything?

If AI can do physical design, why should I learn physical design? This blog will…

P Saisrinivas 31 Aug 2026 • 3 min read
digital badge , Silicon Signoff and Verification , CDNLive India , online courses , Innovus Implementation System , CadenceLIVE2026 , AI Assistant , cerebrus , AI ChatBot , Cadence Online Support , Floorplanning , RTL-to-GDSII , training , Logic Design , Cadence training , Digital Implementation , Innovus , implementation , physical design , Timing analysis , Genus Synthesis Solution , CDNLive! , RTL2GDSII , Synthesis , signoff , Gate level netlist , Tempus Timing Signoff Solution , Cadence Live India 2026 , physical implementation , cadence learning and support

Physical Systems Simulation (CAE)

Part 3: From Flow Simulation to Acoustic Insight with Cradle CFD and Actran

In Part 1 , we introduced aeroacoustics as the sound generated by moving air. In…

Cadence MSC Software 27 Aug 2026 • 4 min read
CFD , Actran , aeroacoustics , Cradle CFD , simulation software , multiphysics

Corporate News

OLogic: Engineering Smarter Robots and Edge AI Devices with Cadence

As AI moves beyond the cloud and into robots, smart appliances, and connected devices…

Tanushri Shah 27 Aug 2026 • 2 min read
digital twin , designed with cadence , robotics

Learning and Support

Training Webinar: Jasper Static: Comprehensive Signoff for RTL Designers

Cadence Jasper Static (Jasper Superlint and CDC/RDC Apps) delivers a comprehensive…

ErinGrant 26 Aug 2026 • 2 min read
webinar , Cadence training , learning and support
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